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Alkali-developable resin, and photosensitive resin composition using the same

A technology of photosensitive resin and alkali developing type, which is applied in the field of photosensitive resin composition, which can solve the problems that the unexposed part of the coating film cannot be quickly removed, shorten the drying time, etc., and achieve excellent properties and excellent alkali developability , the effect of low-cost productivity

Inactive Publication Date: 2017-09-12
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is necessary to shorten the drying time in the solvent drying process after coating the substance containing printing ink on the substrate. In a series of processes from drying to exposure and development, if it takes a long time after drying, there is no possibility of Quickly remove problems such as unexposed parts of the coating film

Method used

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  • Alkali-developable resin, and photosensitive resin composition using the same
  • Alkali-developable resin, and photosensitive resin composition using the same
  • Alkali-developable resin, and photosensitive resin composition using the same

Examples

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Embodiment

[0132] Hereinafter, the present invention will be described in detail by way of examples and comparative examples, but the present invention is not limited to these examples. In addition, "parts" and "%" in each example represent "parts by weight" and "% by weight", respectively, unless otherwise specified.

Synthetic example 1

[0133] Synthesis Example 1 (Synthesis Example of Resin Y-1)

[0134] 118 parts (1.0 equivalent) of cresol novolac resin [Shonol CRG-951, manufactured by Showa Polymer Co., Ltd., hydroxyl equivalent 118, softening point 96° C., number average molecular weight 750] and propylene glycol monomethyl ether acetate 124.71 parts were charged. , heated to 80°C, and the above mixture was uniformly dissolved. After confirming the dissolution, 37.04 parts (0.5 mol) of glycidol and 0.47 parts of triphenylphosphine were added thereto, heated to 120° C., and reacted for about 8 hours to obtain a reaction product X (resin: intermediate X). As a result of measuring the reaction rate by GPC (gel permeation chromatography), the reaction rate of glycidol was 98%. Next, 32.03 parts (0.17 moles) of trimellitic anhydride were added to the reaction liquid containing the reaction product X, and reacted at 100° C. for about 6 hours to obtain curable resin (Y-1) of the present invention (solid acid val...

Synthetic example 2

[0135] Synthesis Example 2 (Synthesis Example of Resin Y-2)

[0136] Drop into biphenyl aralkyl type phenolic resin [GPH-103, manufactured by Nippon Kayaku Co., Ltd., hydroxyl equivalent 239, softening point 103° C., all phenolic hydroxyl groups are resorcinol hydroxyl groups (resorcinol hydroxyl groups 100%), weight Average molecular weight 3220] 239 parts (1.0 equivalent) and propylene glycol monomethyl ether acetate 222.04 parts, heated to 80 ° C, the above mixture was uniformly dissolved. After confirming the dissolution, 37.04 parts (0.5 mol) of glycidol and 0.83 parts of triphenylphosphine were added thereto, heated to 120° C., and reacted for about 8 hours to obtain a reaction product X (resin: intermediate X). The reaction rate was determined by GPC measurement, and the reaction rate of glycidol was 98%. Next, 57.02 parts (0.3 moles) of trimellitic anhydride were added to the reaction liquid containing the reaction product X, and reacted at 100° C. for about 6 hours t...

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Abstract

The present invention relates to an alkali development type resin which is obtained by reacting a compound (b) having an alcoholic hydroxyl group and one epoxy group in the molecule with the hydroxyl groups of a phenolic resin (a), and further reacting the hydroxyl groups in the obtained reaction product X with saturated and / or unsaturated polybasic acid anhydride (c); and relates to a photosensitive resin composition containing (A) said alkali development type resin, (B) an epoxy resin, (C) a photopolymerization initiator, and (D) a diluent. Said resin composition has excellent drying properties and alkali developability, and a coated film after curing is outstanding in various characteristics such as adhesion, solder heat resistance, electroless gold plating resistance, PCT resistance, flexibility, thermal shock resistance, and HAST characteristics, and is useful as a solder resist, etching resist, plating resist, or inter-layer insulating material used during manufacture of printed wiring boards.

Description

technical field [0001] The present invention relates to an alkali-developing resin and a photosensitive resin composition containing the resin. More specifically, it relates to an alkali-developing type resin and a photosensitive resin composition used in the field of electronic materials such as solder resists for printed wiring boards, interlayer insulating films for high-density multilayer boards, and solder resists for semiconductor packaging. Background technique [0002] In the past, fixed mask resists in the manufacture of printed wiring boards could be produced by screen printing heat-curable or ultraviolet-curable resist inks. direction of development. [0003] However, PCT (Pressure Cooker Test (Pressure Cooker Test)) which is a long-term reliability test for packages has poor resistance to conventionally marketed printed wiring boards to which alkali-developing solder resists have been applied, and peeling of cured products occurs. [0004] In addition, due to t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/32G03F7/038H05K3/00H05K3/46
CPCC08G14/12C09D161/34G03F7/027G03F7/032G03F7/038H05K3/0076H05K3/287C08G8/22C08G8/32
Inventor 山本和义关根健二堀口尚文
Owner NIPPON KAYAKU CO LTD
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