Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of high heat resistance and high crosslinking degree photocurable solder resist ink and preparation method thereof

A technology of high cross-linking and solder resist ink, which is applied in the fields of high heat resistance and high cross-linking degree light-curing solder resist ink and its preparation, high cross-linking degree light-curing solder resist ink and its preparation field, which can solve the problem of changing the resistance of the system. Heat, uneven dispersion of the system, affecting product quality and other problems, to achieve the effect of improving product performance, reducing the amount of photoinitiator added, and reducing the impact of cured film performance

Active Publication Date: 2022-04-15
鹤山市炎墨科技有限公司
View PDF11 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, physical modification fails to fundamentally change the heat resistance of the system, and there may be uneven dispersion of the system during use, phase separation during long-term storage, and difficulty in uniform film formation during coating
The currently used chemical modification method is mainly through the introduction of some rigid heat-resistant segments on the main chain structure of carboxylated epoxy acrylate, which will involve a variety of side reactions during the synthesis process, resulting in the appearance of various by-products. The presence of these by-products is difficult to separate and affects the overall quality of the product

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of high heat resistance and high crosslinking degree photocurable solder resist ink and preparation method thereof
  • A kind of high heat resistance and high crosslinking degree photocurable solder resist ink and preparation method thereof
  • A kind of high heat resistance and high crosslinking degree photocurable solder resist ink and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0055] Under nitrogen protection, add 50.0g of diethylene glycol diethyl ether acetate (DCAC) into a 1L three-necked flask equipped with a stirrer, raise the temperature to 90°C, add 88.8g of epoxy resin NPCN-704, and keep the temperature for one hour to fully Dissolve, cool down to 60°C and add 57.3g of 2,2-dimethylolpropionic acid (DMPA) dissolved in 40g of diethylene glycol ether acetate (DCAC) (the molar ratio of epoxy group to carboxyl group is 1: 1), heat up to 70°C and then add 1.5g of catalyst 4-dimethylaminopyridine dissolved in 2g of diethylene glycol ethyl ether acetate, stir and react at a constant temperature of 95°C for 1 hour, then heat up to 105°C and stir at a constant temperature React for 12 hours. Then cool the reaction system to 80°C, add 94.0 g of itaconic anhydride dissolved in 30 g of diethylene glycol ethyl ether acetate (the molar ratio of carboxylic acid to anhydride is 1:2.1) and 0.5 g of hydroquinone as a polymerization inhibitor , the temperature...

Synthetic example 2

[0057] Under nitrogen protection, add 50.0g of diethylene glycol diethyl ether acetate (DCAC) into a 1L three-necked flask equipped with a stirrer, raise the temperature to 90°C, add 88.8g of epoxy resin NPCN-704, and keep the temperature for one hour to fully Dissolve, cool down to 60°C and add 57.3g of 2,2-dimethylolpropionic acid (DMPA) dissolved in 40g of diethylene glycol ether acetate (DCAC) (the molar ratio of epoxy group to carboxyl group is 1: 1), heat up to 70°C and then add 1.5g of catalyst 4-dimethylaminopyridine dissolved in 2g of diethylene glycol ethyl ether acetate, stir and react at a constant temperature of 95°C for 1 hour, then heat up to 105°C and stir at a constant temperature React for 12 hours. Then the reaction system was cooled to 80°C, and 82.2 g of maleic anhydride (MAH) dissolved in 30 g of diethylene glycol ether acetate (the molar ratio of carboxylic acid to anhydride was 1:2.1) and a pair of polymerization inhibitors were added. 0.5 g of hydroqu...

Synthetic example 3

[0059] Under nitrogen protection, add 50.0g of diethylene glycol diethyl ether acetate (DCAC) into a 1L three-necked flask equipped with a stirrer, raise the temperature to 90°C, add 88.8g of epoxy resin NPCN-704, and keep the temperature for one hour to fully Dissolve, cool down to 60°C and add 63.3g of 2,2-dimethylolbutyric acid (DMBA) dissolved in 40g of diethylene glycol ether acetate (DCAC) (the molar ratio of epoxy group to carboxyl group is 1: 1), heat up to 70°C and then add 1.5g of catalyst 4-dimethylaminopyridine dissolved in 2g of diethylene glycol ethyl ether acetate, stir and react at a constant temperature of 95°C for 1 hour, then heat up to 105°C and stir at a constant temperature React for 12 hours. Then cool the reaction system to 80°C, add 94.0 g of itaconic anhydride dissolved in 30 g of diethylene glycol ethyl ether acetate (the molar ratio of carboxylic acid to anhydride is 1:2.1) and 0.5 g of hydroquinone as a polymerization inhibitor , the temperature w...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
epoxy equivalentaaaaaaaaaa
Login to View More

Abstract

The invention provides a photocurable solder resist ink with high heat resistance and high crosslinking degree and a preparation method thereof. The raw materials of the solder resist ink mainly include: alkali-soluble photocurable epoxy resin containing dihydroxy group carboxylic acid in parts by weight 100 parts of resin, 3 to 10 parts of photoinitiator; wherein, the alkali-soluble photocurable epoxy resin containing dihydroxy group carboxylic acid is firstly carried out ring-opening reaction by epoxy resin and dihydroxy group carboxylic acid, It is obtained by esterification reaction with unsaturated acid anhydride. The prepared photocurable solder resist ink can be immersed in the trough at 260°C for at least 40s (or even 1min) after curing without discoloration and peeling off. In addition, it has good flame retardancy and anti-aging performance. Welding heat performance, solvent resistance, chemical resistance, electroless gold plating resistance, electroless tin plating resistance, electrical characteristics are excellent in all aspects.

Description

technical field [0001] The invention belongs to the technical field of photocurable inks, and relates to a photocurable solder resist ink with high heat resistance and high crosslinking degree and a preparation method thereof, in particular to a photocurable solder resist ink with high crosslinking degree for printed circuit boards and its preparation method. Background technique [0002] Printed circuit board (PCB for short), is the substrate of modern electrical installation and connection components, and is an important basic assembly in the electronics industry. [0003] Among them, photocurable solder resist ink is one of the key materials of printed circuit board (PCB). Short circuit, adjust the amount of solder adhesion, reduce the dissolved pollution of copper in the weld, save solder, reduce the weight of the instrument, increase the high density of wiring, avoid false soldering and improve the inspection speed. [0004] With the development of PCB substrates in t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/101C09D11/102C09D11/03
CPCC09D11/101C09D11/102C09D11/03
Inventor 李明辉徐明亨谢明星张军华尹邦超
Owner 鹤山市炎墨科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com