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Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

A technology of resin composition and compound, which is applied in printed circuit components, circuit substrate materials, conductive pattern layout details, etc., can solve the problems of longer processing time, etc., and achieve the effects of viscosity suppression and good alkali developability

Active Publication Date: 2022-07-22
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]On the other hand, drilling by laser processing has the problem that the processing time is indeed longer for high-density substrates with a large number of holes.

Method used

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  • Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
  • Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
  • Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0413] (Preparation of resin composition and resin sheet)

[0414] To 60 parts by mass of MIZ-001 (trade name) as the bismaleimide compound (A), and 25 parts by mass of BCPH13 (trade name) manufactured by Kunei Chemical Industry Co., Ltd. as the maleimide compound (B) , 15 parts by mass of TMDM as maleimide compound (B), bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (Omnirad (registered) as photocuring initiator (C) Trademark) 819 (trade name) 5 parts by mass, 10 parts by mass of cis-4-cyclohexene-1,2-dicarboxylic acid anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) as a compound (D) having one or more carboxyl groups , mixed with 168.8 parts by mass of methyl ethyl ketone (manufactured by Idemitsu Kosan Co., Ltd.) as an organic solvent, and stirred in a 90° C. hot water bath to obtain a varnish (resin composition). The varnish was added dropwise to a 38 μm-thick PET film (Unitika A coating film was formed on Unipeel (registered trademark) TR1-38 (trade name...

Embodiment 2

[0422] As the bismaleimide compound (A), 50 parts by mass of MIZ-001 (trade name) was used instead of 60 parts by mass of MIZ-001 (trade name), and as the maleimide compound (B), 25 parts by mass of TMDM was used Except having replaced 15 mass parts of TMDM, it carried out similarly to Example 1, and obtained a varnish and a resin sheet. Moreover, using a resin sheet, it carried out similarly to Example 1, and obtained the resin for evaluation and the laminated body for evaluation.

Embodiment 3

[0424] As the bismaleimide compound (A), 55 parts by mass of MIZ-001 (trade name) was used instead of 60 parts by mass of MIZ-001 (trade name), and 20 parts by mass of TMDM was used as the maleimide compound (B) Except having replaced 15 mass parts of TMDM, it carried out similarly to Example 1, and obtained a varnish and a resin sheet. Moreover, using a resin sheet, it carried out similarly to Example 1, and obtained the resin for evaluation and the laminated body for evaluation.

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Abstract

The invention provides a resin composition, a resin sheet using the same, a multilayer printed wiring board, and a semiconductor device. The resin composition has good solubility and photocurability, has good alkali developability when containing a photopolymerization initiator and a compound having one or more carboxyl groups, and can obtain a resin sheet with suppressed stickiness. This resin composition contains: a specific bismaleimide compound (A); and at least two maleimide compounds (B) that are different from the bismaleimide compound (A) and that are selected from the group consisting of six specific compounds.

Description

technical field [0001] The present invention relates to a resin composition, a resin sheet using the same, a multilayer printed wiring board, and a semiconductor device. Background technique [0002] Due to the miniaturization and high density of the multilayer printed wiring board, researches for reducing the thickness of the laminate used for the multilayer printed wiring board are being carried out. With thinning, the insulating layer is also required to be thinned, and a resin sheet that does not contain glass cloth is being sought. In the resin composition used as the material of the insulating layer, a thermosetting resin is the mainstream, and drilling for obtaining conduction between the insulating layers is usually performed by laser processing. [0003] On the other hand, the drilling by laser processing has a problem that the processing time for a high-density substrate with a large number of holes becomes long. Therefore, in recent years, there has been a deman...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L45/00C08K5/07C08K5/101C08K5/53H05K1/03C08F234/00
CPCC08F234/00C08K5/07C08K5/101C08L79/085C08G73/12C08G73/126C08F2/48H05K1/0346H05K3/287C08G73/10C08L79/08C08K5/53H05K1/0298H05K1/03C08K5/092
Inventor 熊泽优音铃木卓也四家诚司片桐俊介
Owner MITSUBISHI GAS CHEM CO INC
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