Light solidifying/heat solidifying resin composition, condensate of the same and printing circuit board

A resin composition, thermosetting technology, applied in printed circuit, printed circuit manufacturing, optics, etc., can solve the problems of lack of electrical characteristics, intolerance to high temperature heat treatment, insufficient heat resistance, etc., and achieve small curing shrinkage , Excellent PCT resistance, excellent adhesion effect

Inactive Publication Date: 2008-01-16
TAIYO INK MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the solder resist using this photosensitive resin can prevent the warping and swelling of the printed circuit board, it also has the disadvantage that it cannot withstand the high-temperature heat treatment in the above-mentioned IC package manufacturing process, and cannot obtain the necessary electrical characteristics.
However, such a photosensitive resin also has the problem that it is insufficient in heat resistance required for high-temperature heat treatment as described above.
This resin is excellent in heat resistance, adhesiveness, and electrical insulation, and is useful for packaging substrates using a core material having a certain thickness, but it is difficult to satisfy the above-mentioned extremely thin core material such as preventing warping and swelling. Require

Method used

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  • Light solidifying/heat solidifying resin composition, condensate of the same and printing circuit board

Examples

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Embodiment

[0137] Hereinafter, the present invention will be specifically described by showing examples and comparative examples, but of course the present invention is not limited to the following examples.

Synthetic example 1

[0138] Synthesis Example 1: Synthesis 1 of Carboxyl Group-Containing Photosensitive Resin (A-1)

[0139] Add 2200 g of cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-104S, softening point 92° C., epoxy equivalent 220), 134 g of dimethylol propionic acid, 648.5 g of acrylic acid, and methylhydroquinone 4.6 g, 1131 g of carbitol acetate and 484.9 g of solvent naphtha were heated to 90° C. and stirred to dissolve the reaction mixture. Next, the reaction liquid was cooled to 60° C., 13.8 g of triphenylphosphine was added, heated to 100° C., and reacted for about 32 hours to obtain a reactant having an acid value of 0.5 mgKOH / g. Next, 364.7 g of tetrahydrophthalic anhydride, 137.5 g of carbitol acetate, and 58.8 g of solvent naphtha were added thereto, heated to 95°C, allowed to react for about 6 hours, and cooled to obtain a solid content of acid A carboxyl group-containing photosensitive resin with a price of 40 mgKOH / g and a non-volatile content ...

Synthetic example 2

[0140] Synthesis Example 2: Synthesis 2 of Carboxyl Group-Containing Photosensitive Resin (A-1)

[0141] In a four-necked flask equipped with a stirrer and a condenser, 2,200 g of cresol novolak-type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-104S, softening point 92° C., epoxy equivalent 220) was added, and propylene glycol was added. 2072 g of methyl ether acetate was dissolved by heating, and then 4.6 g of methyl hydroquinone and 13.8 g of trimethylphosphine were added. This mixture was heated to 95-105 degreeC, and 504 g of acrylic acid and 415 g of p-hydroxyphenethyl alcohol were dripped slowly, and it was made to react for about 16 hours. The reactant was cooled to 80-90° C., 730 g of tetrahydrophthalic anhydride was added thereto, allowed to react for about 8 hours, and cooled to obtain a solid component with an acid value of 70 mgKOH / g and a nonvolatile content of 65%. Carboxyl photosensitive resin. Hereinafter, this reaction solution is called varnis...

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Abstract

The present invention provides a photo curable and heat curable resin composition, the condensate of which and the printed circuit board. The composition includes the following components: (A-1) a carboxyl-containing photosensitive resin which is reacted by the reaction product and polyol acid anhydrides (d), and the reaction product is reacted by epoxides (a) and compound (b) and the monocarboxylic acid (c) containing undersaturated groups, (A-2) a carboxyl-containing photosensitive resin which is reacted by the compound (e) containing phenolic hydroxyl group reacted to the oxiranes (f) or cyclic carbonates compound (g), and the monocarboxylic acid (c) containing undersatruated groups and polyol acid anhydrides (d), (A-3) random one of the carboxyl-containing photosensitive resins which are reacted by the reaction product and the polyol acid anhydrides (d), and the reaction product is reacted by the linear polyfunctional epoxides (h) and the monocarboxylic acid (c) containing undersatruated groups; and (B) a carboxylated urethane (methyl) acrylic ester compound; (C) a photopolymerization evocating agent; (D) heat curable component; and (E) a diluent.

Description

technical field [0001] The present invention relates to a photocurable / thermosetting resin composition, its cured product, and a printed circuit board. The composition is useful in the manufacture of semiconductor package substrates used in small and lightweight electronic equipment. Background technique [0002] Recent electronic devices, such as portable phones, tend to be smaller, lighter, more functional, and more multifunctional. Accordingly, semiconductor integrated circuits (hereinafter referred to as ICs) used in these electronic devices also require Higher integration, miniaturization, thinner. Corresponding to such requirements, packages containing semiconductor ICs have also appeared that use insulating substrates coated with solder resist and sealing resins called BGA (Ball Grid Array Package) or CSP (Chip Scale Package, Chip Scale Package). ) instead of IC packages called QFP (Quad Flat Pack) and SOP (small Out-Line package) that use a lead frame and sealing re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/028G03F7/004H05K1/00H05K3/00
Inventor 峰岸昌司吉田贵大依田健志
Owner TAIYO INK MFG CO LTD
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