Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method

一种感光性树脂、电路基板的技术，应用在电路基板材料、印刷电路制造、印刷电路等方向，能够解决难以降低制造成本、制造工序数增加等问题，达到实现制造成本、优异柔软性、良好耐弯折性的效果

Inactive Publication Date: 2010-10-27
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the combined use of such a cover film and solder resist involves an increase in the number of manufacturing steps, making it difficult to reduce manufacturing costs

Method used

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  • Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method
  • Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method
  • Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4、 comparative example 1、2

[0090] A photosensitive resin composition was prepared by mixing the components shown in Table 2 below in proportions (parts by weight) shown in the same table (in addition, the parts of polymers a to d in the table are solid content weight share).

[0091] The tensile elongation at break and the 2% weight loss temperature of the cured product of the photosensitive resin composition thus obtained were measured according to the following criteria, and the results are shown in Table 2 below.

[0092] Tensile elongation at break

[0093] The photosensitive resin composition (solution) prepared above was coated on one side of a PET film with a thickness of 16 μm, and then dried (80° C.×30 minutes) to form a photosensitive resin composition film with a thickness of 25 μm after drying. . A cover film made of polypropylene with a thickness of 30 μm is attached to the photosensitive resin composition film, and a 250W ultra-high pressure mercury lamp is used at 500mJ / cm 2 UV rays ...

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PUM

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Abstract

A photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after the IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; and (D) a photopolymerization initiator. The photosensitive resin composition has a tensile breaking elongation percentage of not less than 10% and a 2% weight loss temperature of not lower than 260 DEG C. after being cured.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a flexible circuit board obtained by using the composition, and a method for producing the circuit board. Background technique [0002] In flexible circuit boards on which electronic components such as semiconductor elements are mounted by soldering, a surface protection layer (cover insulating layer) is provided on the conductor pattern forming surface of the wired circuit board. Usually, the surface protection layer is called a cover film (Coverlay film), and is formed by affixing a polyimide film punched into a predetermined shape and forming an adhesive layer. In addition, in the portion where a thinner opening shape (corresponding to the shape of the opening provided on the substrate) is required, a film-like film called a film-like film is provided on the necessary part of the above-mentioned conductor pattern formation surface by the screen printing method or the exposure and d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/032H05K1/03H05K3/28
CPCH05K1/0393H05K3/287G03F7/033G03F7/032
Inventor 水谷昌纪马场俊和
Owner NITTO DENKO CORP
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