Solder resist composition and printed wiring board

A technology for printed circuit boards and compositions, which is applied in the directions of printed circuits, printed circuit manufacturing, and secondary treatment of printed circuits, etc. It can solve the problems of reduced reflectivity, insufficient absorption, and difficulty in forming high-definition pattern latent images, and achieves Effect of increasing illuminance and suppressing decrease in reflectance
CN102722083AActive Publication Date: 2012-10-10TAIYO HLDG CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TAIYO HLDG CO LTD
Publication Date
2012-10-10

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Abstract

A high reflective / high definition solder composition and a printed circuit board using thereof are provided secure the excellent patterning ability by light and resolving potency. A high reflective / high definition solder composition contains a carboxyl containing resin without an aromatic ring, bisacylphosphine oxide based photopolymerization initiator, a mono-acylphosphineoxide based photopolymerization initiator, a photo-polymerizable monomer, a rutile-type titanium oxide, and an organic solvent. The carboxyl containing resin without the aromatic ring is a copolymer resin having a carboxyl group obtained by reacting a (meth) acrylic copolymer resin containing the carboxyl group, and a compound with an ethylenically unsaturated group.
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Description

[0001] This application is a divisional application of Chinese patent application 201010175136.8. The filing date of the original application 201010175136.8 is May 14, 2010, and its name is "solder resist composition and printed circuit board". technical field

[0002] The present invention relates to a solder resist composition capable of forming a high-reflectance solder resist film suitable for use as a permanent mask of a printed circuit board, and the use of the solder resist composition to form a resist on the surface of a printed circuit board formed with a circuit. Printed circuit boards made of solder patterns. Background technique

[0003] In a printed circuit board, circuit wiring is usually formed by etching away unnecessary portions of copper foil bonded to a laminate, and electronic components are arranged at predetermined positions by soldering. In such a printed wiring board, a solder resist film formed by coating and curing on a base material is used as a pr...

Claims

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