power conversion device

Abstract

The present invention provides a power conversion device capable of efficiently cooling a semiconductor power module and miniaturizing the overall structure. It comprises: a semiconductor power module (4); and a cooling body (3), which is arranged on one surface side of the semiconductor power module and cools the semiconductor power module, the cooling body (3) comprising: a cavity (13) ), the cavity (13) is arranged opposite to the installation position of the semiconductor power module, for the cooling medium to circulate, and has opposite long sides and short sides; a long side of the cavity (13) is provided with the cooling medium. a cooling medium supply part (14); and a cooling medium discharge part (15) for discharging the cooling medium from the other long side of the cavity.

Description

technical field [0001] The present invention relates to a power conversion device including a cooling body for cooling a semiconductor power module incorporating a semiconductor switching element for power conversion. Background technique [0002] As such a power conversion device, the power conversion device described in Patent Document 1 is known. The casing of the power conversion device is provided with a water-cooling sleeve, and a semiconductor power module is arranged on the water-cooling sleeve. The Power Module is cooled. In addition, in the casing, a control circuit board is arranged at a predetermined distance on the opposite side of the water-cooling bushing of the semiconductor power module, and the heat generated by the control circuit board is conducted to the metal base plate supporting the control circuit board through the heat dissipation member, And the heat conducted to the metal bottom plate is conducted to the water-cooling sleeve through the side wal...

AI Technical Summary

Problems solved by technology

In this water cooling bushing, when a water supply port and a water discharge port are provided on one end face in the longitudinal direction of the pin-fin insertion region formed on the lower surface of the semiconductor power module in the pin-fin insertion region, the flow rate will decrease. Inhomogeneous and localized eddy currents

Therefore, there is a problem that a portion where the cooling capacity is lowered is generated, and the pressure loss becomes large, and a pump that circulates the refrigerant requires a higher capacity.

In addition, when the water supply port and the drain port are provided on both ends of the long side of the pin-fin insertion area, that is, at the diagonal positions on the short side, most of the cooling water supplied from the water supply port will flow along the guide rail. The side wall of the foot-fin insertion area flows, and the flow velocity in this part is fast, but the flow velocity slows down on the side wall opposite to the water supply port, so the difference in flow velocity becomes large, and there is a difference between the IGBTs mounted in the semiconductor power module. , Diode cooling capacity deviation problem

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