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Adhesive applicable to low temperature and used for electronic paper, and preparation method and application thereof

A technology of electronic paper and adhesives, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve problems such as obstacles to the application of electrophoretic display devices, affect the display performance of electrophoretic display devices, and reduce the glass transition temperature , the resistivity will not rise sharply, and the effect of improving adaptability

Active Publication Date: 2014-10-01
GUANGZHOU OED TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This large change will inevitably affect the display performance of the electrophoretic display device, which will inevitably bring obstacles to the application of electrophoretic display equipment.

Method used

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  • Adhesive applicable to low temperature and used for electronic paper, and preparation method and application thereof
  • Adhesive applicable to low temperature and used for electronic paper, and preparation method and application thereof
  • Adhesive applicable to low temperature and used for electronic paper, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment 1 (without adding aniline group-containing compound and water-soluble conductive inorganic filler)

[0033] 10 parts by weight of aliphatic diisocyanate, 5 parts by weight of aromatic diisocyanate, 10 parts by weight of polyester diol (number average molecular weight 300), 10 parts by weight of polyether diol (number average molecular weight 400), 2 parts by weight of hydrophilic group glycol chain extender, put into the reaction pot at 70°C and stir for 2 hours, the measured NCO% content is 0.5wt%, add acetone according to the mass ratio of 1.3:2 (reaction mixture), lower the temperature Stir until completely dissolved at 40°C, add 1 part by weight of salt-forming agent, stir for 0.5 hours, add deionized water to the mixture at a mass ratio of 1.2 (mixture):1, disperse and emulsify into a water-based adhesive in a high-speed disperser. After dispersing for 1 hour, the acetone was removed in vacuum, and the solid content of the prepared aqueous polyurethane w...

Embodiment 2

[0034] Embodiment 2 (without adding compounds containing aniline groups and water-soluble conductive inorganic fillers)

[0035] 25 parts by weight of aliphatic diisocyanate, 20 parts by weight of aromatic diisocyanate, 40 parts by weight of polyester diol (number average molecular weight 3000), 40 parts by weight of polyether diol (number average molecular weight 3000), 6 parts by weight of a hydrophilic group diol chain extender was put into the reaction pot at 90°C and stirred for 5 hours. The NCO% content was measured to be 6wt%. Add acetone at a mass ratio of 1.3:2 (reaction mixture) and lower the temperature to Stir until completely dissolved at 58°C, add 3 parts by weight of salt-forming agent, stir for 0.5 hours, add deionized water to the mixture at a mass ratio of 1.2 (mixture):1, and disperse and emulsify it into a water-based adhesive in a high-speed disperser. After dispersing for 1 hour, the acetone was removed in vacuum, and the solid content of the prepared aqu...

Embodiment 3

[0036] Embodiment 3 (adding the compound containing aniline group, but not adding water-soluble conductive inorganic filler)

[0037] 10 parts by weight of aliphatic diisocyanate, 5 parts by weight of aromatic diisocyanate, 10 parts by weight of polyester diol (number average molecular weight 300), 10 parts by weight of polyether diol (number average molecular weight 400), 2 parts by weight of hydrophilic group glycol chain extender, put into the reaction pot at 70°C and stir for 2 hours, the measured NCO% content is 0.5wt%, depending on the viscosity, add acetone according to the mass ratio of 1.3:2 (reaction mixture), Lower the temperature to 40°C, stir until completely dissolved, drop 2 parts by weight of the compound containing aniline groups within 0.5 hours, stir for 0.5 hours, add 1 part by weight of a salt-forming agent, stir for 0.5 hours, and mix the mixture according to the mass ratio 1.2 (mixture): 1, add deionized water, disperse and emulsify into a water-based ad...

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PUM

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Abstract

The invention provides an adhesive applicable to low temperature and used for electronic paper. The adhesive comprises a waterborne polyurethane emulsion which is prepared from diisocyanate, polyester polyol with number-average molecular weight of 300 to 3000, polyether polyol with number-average molecular weight of 400 to 3000, a chain extender and a salt forming agent through polymerization, emulsification and dispersion. The invention also provides a preparation method for the adhesive and application of the adhesive in an electrophoretic display apparatus. The electrical properties of the adhesive for the electronic paper have small fluctuation with changes of temperature, and volume resistivity of the adhesive at about 0 DEG C changes a little compared with volume resistivity of the adhesive at normal temperature. The adhesive for the electronic paper can be used as a lamination adhesive in the electrophoretic display apparatus, enables the contrast of the electrophoretic display apparatus to be maintained in a good range when the electrophoretic display apparatus is used at a low temperature (about 0 DEG C) and improves adaptability of the electrophoretic display apparatus to the environment.

Description

technical field [0001] The invention relates to an adhesive for electronic appliances, in particular to an adhesive for electronic appliances suitable for low temperature use and the application of the adhesive in the technical field of photoelectric display (such as electrophoresis display, electronic paper). Background technique [0002] In electro-optical displays, electrophoretic displays have such figure 1 The structure shown: has a pair of first substrate 1 (or referred to as the first substrate) and the second substrate 2 (or referred to as the second substrate) with a conductive layer on the opposite surface. An electrical material layer 5 (or called an electrophoretic display layer) and a glue layer 4 (or called a lamination adhesive layer) are arranged between the first substrate and the second substrate, wherein the glue layer is used to attach the second substrate The bottom is bonded to the electrical material layer and transmits the voltage applied to the seco...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/06C09J175/08C09J11/04C08G18/76C08G18/75C08G18/73C08G18/66C08G18/48C08G18/42C08G18/44C08G18/38C08G18/32G02F1/167
Inventor 罗裕杰白世龙崔德慈张连军盘婷
Owner GUANGZHOU OED TECH INC
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