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Air intake device and plasma processing equipment

A technology of air intake device and air intake end, which is applied to electrical components, discharge tubes, circuits, etc. to reduce losses, avoid reactions, and improve process quality.

Active Publication Date: 2016-08-31
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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AI Technical Summary

Problems solved by technology

[0006] The present invention aims to solve the technical problems existing in the prior art, and provides an air intake device and plasma processing equipment, which can prevent the cleaning gas from flowing into the channel used to transport the process gas, thereby reducing or even avoiding the occurrence of process gas The problem of contamination caused by mixing with cleaning gas can improve the process quality of plasma processing equipment

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  • Air intake device and plasma processing equipment
  • Air intake device and plasma processing equipment
  • Air intake device and plasma processing equipment

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Embodiment Construction

[0037] In order for those skilled in the art to better understand the technical solutions of the present invention, the gas inlet device and the plasma processing equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0038] Figure 2A It is a sectional view of the air intake device provided by the first embodiment of the present invention. see Figure 2A , the intake device is used to transport the process gas provided by the process gas source into the reaction chamber separately during the processing process, and separately transport the cleaning gas provided by the cleaning gas source into the reaction chamber during the cleaning process, the intake device Including the device body 20 , a first channel 21 , a second channel 22 and a one-way channel 23 are formed in the device body 20 . Wherein, the first channel 21 communicates with the inside of the cleaning gas source and the reaction chamber (both a...

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Abstract

The invention provides an air intake device and plasma processing equipment, including a device body, in which a first channel, a second channel and a one-way channel are formed, wherein the first channel is connected to the cleaning gas source and the reaction chamber respectively. The internal communication is used to transport the cleaning gas into the reaction chamber; the inlet end of the second channel is communicated with the process gas source, and the gas outlet end of the second channel is communicated with the first channel through a one-way channel, and the second channel is used to transfer the process gas The gas is transported into the first channel and flows into the reaction chamber through the first channel; and the one-way channel is configured to only be able to transport the process gas in a single direction from the second channel to the first channel. The air intake device provided by the present invention can prevent the cleaning gas from flowing into the channel used to transmit the process gas, thereby reducing or even avoiding the problem of contamination of the process gas due to mixing with the cleaning gas, thereby improving the process quality of the plasma processing equipment .

Description

technical field [0001] The invention belongs to the field of semiconductor equipment manufacturing, and in particular relates to an air intake device and plasma processing equipment. Background technique [0002] During the process of etching, sputtering and deposition using plasma processing equipment, pollution particles such as etching by-products are often generated in the reaction chamber and deposited on the inner wall of the chamber and the surface of parts , these pollution particles accumulate to a certain thickness with the increase of process time, not only will pollute the processed workpiece, but also change the process environment, resulting in adverse effects on the process results, for this reason, it is necessary to A cleaning process is performed on the reaction chamber to remove contamination particles deposited on the inner walls of the chamber and on the surface of the components. [0003] Moreover, since the cleaning process is often carried out altern...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J37/32
Inventor 南建辉王宝全苏晓峰宋巧丽
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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