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High toughness 70DEG C curable epoxy resin prepreg and preparation method thereof

A technology for curing epoxy resin and epoxy resin, which is applied in the field of materials, can solve the problems of short storage period at room temperature, poor toughness, and high curing temperature, and achieve excellent mechanical properties, reduce manufacturing costs, and improve product dimensional stability.

Inactive Publication Date: 2014-11-05
广联航宇(哈尔滨)新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems of poor toughness, high curing temperature and short storage period at normal temperature of the existing epoxy resin prepreg, the present invention provides a high toughness, 70°C curable prepreg and its preparation method

Method used

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Examples

Experimental program
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specific Embodiment approach 1

[0013] Embodiment 1: The high-toughness epoxy prepreg that can be cured at 70°C in this embodiment is prepared from a reinforcement material that can be impregnated with an epoxy resin system that is high-toughness and can be cured at 70°C; The resin system is made of 60-95% epoxy resin mixture and 5-40% curing agent system mixture by mass fraction; the epoxy resin mixture is made of 50-80% epoxy resin, 15-40% It is formed by copolymerization of thermoplastic resin and 1-5% molding curing agent, and the epoxy resin is solid or semi-solid epoxy resin or liquid epoxy resin; the mixture of the curing agent system consists of 20-60% curing agent and 40% by mass fraction ~80% accelerator blend.

[0014] The minimum curing temperature of the high-toughness epoxy prepreg designed in this embodiment and capable of curing at 70°C is 70°C. The lower curing temperature can reduce the manufacturing cost of composite products and improve the dimensional stability of the product; this prepr...

specific Embodiment approach 2

[0015] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the epoxy resin is solid or semi-solid epoxy resin or liquid epoxy resin, and the solid or semi-solid epoxy resin is bisphenol A type epoxy resin, bisphenol S type epoxy resin and novolak epoxy resin or a combination of several; liquid epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol F type epoxy resin, bisphenol A combination of one or more of phenolic S-type epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin, novolac epoxy resin and formaldehyde novolak epoxy resin, the others are the same as in Embodiment 1.

specific Embodiment approach 3

[0016] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the thermoplastic resin is polyolefin, fluororesin, polyamide, polyester, polycarbonate, polyetheretherketone, polyetheramide One or more of imine, polyethylene terephthalate, and polyethersulfone, and one or more of reactive groups such as hydroxyl, carboxyl, amino, and vinyl are contained in the molecular skeleton.

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Abstract

Belonging to the technical field of materials, the invention relates to a high toughness 70DEG C curable epoxy resin prepreg and a preparation method thereof. In order to solve the problems of poor toughness, high curing temperature and short room temperature storage period in existing epoxy resin prepregs, the prepreg is prepared from a high toughness 70DEG C curable epoxy resin system soaking reinforced material, wherein the high toughness 70DEG C curable epoxy resin system is prepared from an epoxy resin mixture and a curing agent system mixture. The epoxy resin mixture is formed by copolymerization of epoxy resin, thermoplastic resin and an addition type curing agent, and the curing agent system mixture is formed by mixing of a catalytic curing agent and an accelerant. The preparation method includes: 1. preparation of the high toughness epoxy resin mixture; 2. preparation of the curing agent system mixture; and 3. preparation of the prepreg. A composite material prepared from the prepreg has high toughness and compression strength after impact greater than 220MPa, can realize complete curing at 70DEG C, and has a room temperature storage period over 30 days.

Description

technical field [0001] The invention belongs to the technical field of materials, and relates to an epoxy resin-based prepreg and a preparation method thereof, in particular to a high-toughness epoxy resin prepreg capable of curing at 70°C and a preparation method thereof. Background technique [0002] Epoxy resin-based prepreg is an important intermediate material for the preparation of aviation and aerospace composite products. At present, the toughness of epoxy resin-based composite materials is low, such as the compressive strength after impact (CAI) is mostly lower than 220MPa, and the impact resistance of the products is poor, which cannot meet the needs of current aerospace composite products. Secondly, when the curing temperature of the epoxy resin prepreg is higher than 120°C, the resulting product will have a large internal stress, which is not conducive to the control of dimensional accuracy. At present, the storage period of the epoxy prepreg that can be cured at...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L63/00C08G59/40C08G59/42C08G59/50C08J5/24
Inventor 李树茂邳志刚
Owner 广联航宇(哈尔滨)新材料科技有限公司
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