UV conductive ink and preparation method thereof
A technology of conductive ink and conductive paste, applied in the field of ink, can solve problems such as environmental pollution, and achieve the effect of less environmental pollution
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[0031] The preparation method according to the UV conductive ink of above-mentioned composition is:
[0032] The preparation of UV flexo conductive ink adopts dispersion method. The dispersion method refers to the use of various machinery to change the coarse particles into fine particles by means of grinding and crushing. It is a physical method.
[0033] 1. Preparation of conductive paste:
[0034] Mix the conductive material, prepolymer, monomer and dispersant, stir the mixture with a stirrer for 30 minutes for pre-dispersion, add the prepared grinding beads, and use a high-speed grinder to grind for 3 hours at a grinding speed of 1800r / min. The material is fully wetted and dispersed to obtain a conductive paste.
[0035] 2. Preparation of ink
[0036] Mix the ground conductive paste, film-forming resin, monomer and photoinitiator, put it in a vessel, put it on a HJ-6A digital display constant temperature multi-head magnetic stirrer, stir at a constant temperature of 40 ...
Embodiment 1
[0039] Embodiment 1: 30 parts of conductive materials, 25 parts of prepolymers, 40 parts of monomers, and 5 parts of dispersants are mixed, wherein the conductive materials are spherical silver powders whose product code is MSP-07, and the prepolymers are polyester acrylic resins. Selected from the CN series of SATORMAR company, the monomer is a mixture of commercially available 2-ethylhexyl acrylate, tripropylene glycol diacrylate and neopentyl glycol diacrylate, and the ratio is 2-ethylhexyl acrylate: Tripropylene glycol diacrylate: neopentyl glycol diacrylate=8:4:3 (weight ratio), and the dispersant is a hyperdispersant with an anchor group selected from the CH series of Shanghai Sanzheng Company, using The mixture was stirred by a stirrer for 30 minutes for pre-dispersion, and then ground for 3 hours using a high-speed grinder to obtain a conductive paste. Mix 20 parts of conductive paste, 30 parts of monomer, 40 parts of film-forming resin, and 10 parts of photoinitiator ...
Embodiment 2
[0040]Embodiment 2: 20 parts of conductive materials, 30 parts of prepolymers, 45 parts of monomers, and 5 parts of dispersants are mixed, wherein the conductive materials are spherical silver powders whose product code is MSP-01, and the prepolymers are commercially available vinyl chloride Resin, the monomer is a commercial mixture of 2-ethoxyethoxyethyl acrylate, hexanediol diacrylate and ethoxylated trimethylolpropane triacrylate in the ratio of 2-ethoxyethyl acrylate Oxyethyl ester: hexanediol diacrylate: ethoxylated trimethylolpropane triacrylate = 10:6:1 (weight ratio), the dispersant is a modified acrylate block copolymer selected from BYK The company's byk-9077 uses a stirrer to stir the mixture for 30 minutes for pre-dispersion, and then uses a high-speed grinder to grind for 3 hours to obtain a conductive paste. Mix 25 parts of conductive paste, 25 parts of monomer, 49 parts of film-forming resin, and 1 part of photoinitiator (including hydrogen donor). The monomers...
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Abstract
Description
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Application Information
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