Unlock instant, AI-driven research and patent intelligence for your innovation.

Conductive adhesive, solar cell module, and method for manufacturing solar cell module

A technology of solar cells and adhesives, which is applied in the direction of conductive adhesives, conductive materials dispersed in non-conductive inorganic materials, adhesives, etc., can solve the problem of deterioration, conductive particle floating conductivity, and inability to expand and ensure contact area and other problems, to prevent the reduction of connection reliability and reduce the effect of connection resistance

Active Publication Date: 2017-06-30
DEXERIALS CORP
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, if Figure 8A ~ Figure 8C As shown, in the case of using spherical particles as the conductive filler, since the contact with the conductive particles sandwiched between the bonding wire and the electrode is point contact, it is not possible to ensure a large contact area.
In addition, if the conductive particles are forcibly pressed into a flat shape in order to expand the contact area with the conductive particles, the conductive particles may float due to the residual stress of the connected conductive particles in the adhesive layer, and the Continuity deterioration

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Conductive adhesive, solar cell module, and method for manufacturing solar cell module
  • Conductive adhesive, solar cell module, and method for manufacturing solar cell module
  • Conductive adhesive, solar cell module, and method for manufacturing solar cell module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0145] In Example 1, an aggregate was obtained using a nickel wire (F255: manufactured by Vale Inco) having a wire diameter of 2 μm to 3 μm. The content of the nickel wire in the conductive adhesive film is 5 parts by mass relative to 80 parts by mass of the adhesive resin component (adhesive resin composition), and the average thickness of the adhesive resin layer (the average thickness of the conductive adhesive film ) is 20 μm, and the diameter of the filament aggregates in the binder resin layer is 2 μm to 4 μm. The ratio of the maximum diameter of the silk aggregate to the average thickness of the conductive adhesive film [maximum diameter of the aggregate (μm)] / [average thickness of the conductive adhesive film (μm)] is 0.2, and the self-conductive adhesive The silk aggregates exposed on the surface of the film were 0% per unit area. In addition, when using a conductive adhesive film, pretreatment such as melting is not required.

Embodiment 2

[0147] In Example 2, the content of the silk aggregates in the conductive adhesive film was 10 parts by mass with respect to 80 parts by mass of the binder resin component (adhesive resin composition). The diameter of the aggregated filaments in the binder resin layer is 5 μm to 15 μm. In addition, [maximum diameter of aggregate (μm)] / [average thickness of conductive adhesive film (μm)] was 0.8. Other conditions are identical with embodiment 1.

Embodiment 3

[0149] In Example 3, the content of the silk aggregates in the conductive adhesive film was set to 20 parts by mass with respect to 80 parts by mass of the binder resin component (adhesive resin composition). The diameter of the aggregated filaments in the binder resin layer is 5 μm to 20 μm. In addition, [the maximum diameter of the aggregate (μm)] / [the average thickness of the conductive adhesive film (μm)] is 1.0, and the silk aggregate exposed from the surface of the conductive adhesive film is 5% per unit area. . Other conditions are identical with embodiment 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention provides a conductive adhesive for connecting electrodes and bonding wires of a solar cell, comprising an adhesive resin composition and conductive filament aggregates.

Description

technical field [0001] The present invention relates to a conductive adhesive for connecting an electrode formed on a solar cell to a tab wire, and more particularly to a conductive adhesive modified with a conductive filler and to connect a tab wire using the conductive adhesive A solar cell module and a method for manufacturing the solar cell module. Background technique [0002] Conventionally, in a solar cell module, solder is used to connect electrodes formed on a solar cell to bonding wires serving as internal connection wires. For example, in a crystalline silicon-based solar battery module, a plurality of adjacent solar battery cells are connected by bonding wires, and the bonding wires are formed of ribbon-shaped copper foil coated with solder or the like as internal connecting wires. [0003] One end of the bonding wire is connected to a surface electrode of one solar cell, and the other end is connected to a back electrode of an adjacent solar cell, whereby the s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/05H01B1/22C09J9/02C09J7/10
CPCC09J9/02C09J11/04H01B1/22H01L31/02013H01L31/048H01L31/0504C08K7/02C08K2201/001Y02E10/50H01L31/0512C09J2203/322C08L63/00C08K2003/0862C08K3/08C08K2201/016C09J7/10C09J2301/314C09J2301/408
Inventor 森大地
Owner DEXERIALS CORP