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Flexible capacitive acceleration sensor and manufacturing method thereof

An acceleration sensor, flexible capacitor technology, applied in the direction of measuring acceleration, velocity/acceleration/impact measurement, manufacturing microstructure devices, etc., can solve the problems of complex processing technology and structure, high manufacturing cost, and achieve low cost, simple process and structure. Effect

Active Publication Date: 2014-11-12
SUZHOU LEANSTAR ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is how to overcome the defects that the existing capacitive acceleration sensor cannot be folded or bent, the manufacturing cost is high, and the processing technology and structure are relatively complicated

Method used

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  • Flexible capacitive acceleration sensor and manufacturing method thereof
  • Flexible capacitive acceleration sensor and manufacturing method thereof
  • Flexible capacitive acceleration sensor and manufacturing method thereof

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Experimental program
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Effect test

Embodiment 1

[0027] Please refer to figure 2 and image 3 , figure 2 It is a schematic cross-sectional view of the flexible capacitive acceleration sensor of the present invention, such as figure 2 As shown, the flexible substrate 1, the flexible substrate 1 is polyethylene terephthalate (PET, polyethylene terephthalate); the upper electrode 3, the upper electrode 3 is gold (Au) or copper (Cu) metal film, Set on the upper surface of the flexible substrate 1; the lower electrode 5, the lower electrode 5 is Au or Cu metal film, set on the lower surface of the flexible substrate 1; the connection layer, the connection layer is chromium (Cr) Or a titanium (Ti) metal thin film, which includes an upper connection layer 2 and a lower connection layer 4, the upper connection layer 2 is arranged between the flexible substrate 1 and the upper electrode 3 and connects the flexible substrate 1 and the upper electrode 3 , the lower connection layer 4 is disposed between the flexible substrate 1 a...

Embodiment 2

[0038] Please refer to figure 2 and image 3 , figure 2 It is a schematic cross-sectional view of the flexible capacitive acceleration sensor of the present invention, such as figure 2 As shown, the flexible substrate 1, the flexible substrate 1 is polyimide (PI, polyimide); the upper electrode 3, the upper electrode 3 is an Au or Cu metal film, and is arranged on the upper surface of the flexible substrate 1; The lower electrode 5, the lower electrode 5 is an Au or Cu metal film, which is located on the lower surface of the flexible substrate 1; the connection layer, the connection layer is a Cr or Ti metal film, which includes an upper connection layer 2 and a lower connection layer. layer 4, the upper connection layer 2 is arranged between the flexible substrate 1 and the upper electrode 3 and connects the flexible substrate 1 and the upper electrode 3, and the lower connection layer 4 is arranged between the flexible substrate 1 and the lower electrode 5 and connect ...

Embodiment 3

[0049] Please refer to figure 2 and image 3 , figure 2 It is a schematic cross-sectional view of the flexible capacitive acceleration sensor of the present invention, such as figure 2 Shown, flexible substrate 1, described flexible substrate 1 is polydimethylsiloxane (PDMS); Upper electrode 3, described upper electrode 3 is Au or Cu metal thin film, is arranged on the upper surface of described flexible substrate 1 ; the lower electrode 5, the lower electrode 5 is Au or Cu metal film, located on the lower surface of the flexible substrate 1; the connection layer, the connection layer is Cr or Ti metal film, which includes the upper connection layer 2 and the lower A connection layer 4, the upper connection layer 2 is arranged between the flexible substrate 1 and the upper electrode 3 and connects the flexible substrate 1 and the upper electrode 3, and the lower connection layer 4 is arranged between the flexible substrate 1 and the lower electrode 3. The flexible substr...

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Abstract

The invention relates to the technical field of acceleration measurement, and discloses a flexible capacitive acceleration sensor. The flexible capacitive acceleration sensor comprises a flexible substrate, a top electrode, a bottom electrode and connection layers. The top electrode is arranged on the upper surface of the flexible substrate. The bottom electrode is arranged on the lower surface of the flexible substrate. The connection layers comprise the upper connection layer and the lower connection layer. The upper connection layer is arranged between the flexible substrate and the top electrode and is connected with the flexible substrate and the top electrode. The lower connection layer is arranged between the flexible substrate and the bottom electrode and is connected with the flexible substrate and the bottom electrode. The invention further discloses a method for manufacturing the flexible capacitive acceleration sensor. An MEMS component is directly arranged on the flexible substrate, the process and the structure are simple, the cost is low, and the manufactured flexible capacitive acceleration sensor can be applied to the surfaces of objects of any types, shapes and sizes.

Description

technical field [0001] The invention relates to the technical field of acceleration measurement, in particular to a high-sensitivity flexible capacitive acceleration sensor prepared based on MEMS micro-nano processing technology. Background technique [0002] An accelerometer is an electronic device capable of measuring acceleration force, which is closely related to human life. At present, the application fields of acceleration sensors are more and more extensive, such as car safety (airbags, anti-lock braking systems and traction control systems), game control, automatic image flipping and pedometers, etc. Since the rapid development of MEMS technology in the 1980s, more and more advanced technologies and equipment have appeared in various industries, and with the rapid development of the integrated circuit and semiconductor industries, new technologies have been used to prepare Micro-nano sensors have also become one of the global research hotspots. Micro-acceleration s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01P15/125B81B3/00B81C1/00
Inventor 刘瑞张珽谷文沈方平丁海燕祁明锋
Owner SUZHOU LEANSTAR ELECTRONICS TECH
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