Bonding pad structure of SMT component, installation method and circuit board

A technology of pads and parts, which is applied in the field of pad structure, mounting method and circuit board, so as to avoid bad effects

Inactive Publication Date: 2014-11-12
GUANGDONG MIDEA GRP WUHU REFRIGERATING EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, the amount of solder paste printed on the left and right sides is the same, but there will be a relative offset between the printing position of the solder paste at the solder paste printing station and the position where the chip capacitor is pasted at the SMT station

Method used

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  • Bonding pad structure of SMT component, installation method and circuit board
  • Bonding pad structure of SMT component, installation method and circuit board
  • Bonding pad structure of SMT component, installation method and circuit board

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Embodiment Construction

[0042] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0043] see Figure 10 , Figure 11-1 with Figure 11-2 , the mounting method of the SMT part in the preferred embodiment of the present invention, the SMT part 10 includes a body, and the first electrode 11 and the second electrode 12 arranged at the opposite ends of the body, the mounting method includes:

[0044] In step S110 , at least two pads for soldering the SMT parts 10 are provided on the surface of a substrate 20 . In this embodiment, it includes a first pad 31 and a second pad 31 for welding the first electrode 11 and the second electrode 12 respectiv...

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PUM

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Abstract

The invention provides a bonding pad structure of an SMT component, an installation method and a circuit board. The bonding pad structure comprises at least two bonding pads arranged on the surface of a substrate, the SMT component comprises a body, a first electrode and a second electrode, the first electrode and the second electrode are arranged at the two opposite ends of the body, each bonding pad is provided with a solder resist area used for limiting flowing of liquid tin, and the first electrode and the second electrode are welded to the two bonding pads respectively and are at least partially opposite to the solder resist areas respectively. According to the bonding pad structure of the SMT component and the installation method, the bonding pads are provided with the solder resist areas, the flowing direction of tin paste which becomes liquid after being melted is limited through the solder resist areas, the liquid tin moves towards the bonding pads or the electrodes and is attached to the bonding pads or the electrodes, and accordingly the amount of the liquid tin attached to the two opposite electrodes of the SMT component is almost the same, stress difference produced by attachment of the liquid tin between the two opposite electrodes is little and poor tombstoning phenomena are avoided.

Description

technical field [0001] The invention relates to semiconductor manufacturing technology, in particular to a pad structure of an SMT part, a mounting method and a circuit board. Background technique [0002] Semiconductor parts can be roughly divided into two categories according to the difference in form when mounted on a substrate. One is surface mounted parts, generally called SMT (Surface Mount Technology) parts; the other is lead insertion parts. Some of the SMT parts do not use human hands, but can be installed mechanically and automatically in a short time. The advantage of lead insertion parts is that there are multiple electrodes, and it is easier to pass large currents. [0003] The installation of SMT parts is to print electrical bonding materials such as solder paste on the flat circuit diagram of the substrate, place SMT parts on it to configure the electrode terminals of the SMT parts, and then perform heat treatment and cooling, so that the substrate and SMT p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/18H05K3/34
Inventor 高桥亘
Owner GUANGDONG MIDEA GRP WUHU REFRIGERATING EQUIP CO LTD
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