Composite multilayer ceramic electronic component

一种电子部件、陶瓷的技术，应用在复合层叠陶瓷电子部件领域，能够解决玻璃成分量稳定化、失去单独时特性等问题，达到Qf值高、绝缘可靠性高、提高绝缘可靠性的效果

Inactive Publication Date: 2014-11-12
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In particular, since the glass contained in the glass-ceramic compositions described in each of Patent Documents 1 and 2 has a composition that is easily crystallized, it is difficult to stabilize the amount of crystals and the amount of glass components at the time of completion of firing. It is presumed that as a result of co-firing of the low dielectric constant ceramic layer and the high dielectric constant ceramic layer, the individual characteristics of each ceramic layer are likely to be lost.

Method used

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  • Composite multilayer ceramic electronic component
  • Composite multilayer ceramic electronic component
  • Composite multilayer ceramic electronic component

Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0108] In Experimental Example 1, evaluation of a glass-ceramic single body for a high dielectric constant ceramic layer was performed.

[0109] First, as the first ceramic, mix MgCO at a prescribed ratio 3 and Al 2 o 3 And pre-calcined, wet pulverized, thus producing spinel compound: MgAl 2 o 4 , and to reconcile MgCO at a prescribed ratio 3 and SiO 2 Then pre-calcined and wet pulverized to produce forsterite compound: Mg 2 SiO 4 .

[0110] Next, mix the glass shown in Table 1, MgAl 2 o 4 , Mg 2 SiO 4 , BaO, TiO 2 , as RE 2 o 3 Nd 2 o 3 , MnO, and CuO so as to have the compositions shown in Table 2 and Table 3, and after mixing, an organic solvent and a binder were added to prepare a slurry.

[0111] [Table 2]

[0112]

[0113] [table 3]

[0114]

[0115] Next, the slurry was formed into a sheet by a doctor blade method and dried to obtain a ceramic green sheet. Samples were suitably produced using this ceramic green sheet, and as shown in Table 4 an...

experiment example 2

[0161] In Experimental Example 2, evaluation of a glass-ceramic single body for a low dielectric constant ceramic layer was performed.

[0162] As in the case of Experimental Example 1, a spinel compound: MgAl was prepared as the first ceramic 2 o 4 and forsterite compound: Mg 2 SiO 4 , forming the second ceramic BaO, TiO 2 , as RE 2 o 3 Nd 2 o 3 and Sm 2 o 3 , MnO, and CuO powders.

[0163] In addition, in this Experimental Example 2, as shown in Table 7 and Table 8, MgCO was blended at a predetermined ratio 3 、Al 2 o 3 and SiO 2 Then, calcining and wet pulverization were performed to produce the cordierite compound as the third ceramic: Mg 2 Al 4 Si 5 o 18 of powder. In addition, as shown in the same Table 7 and Table 8, BaCO was blended at a prescribed ratio 3 、Al 2 o 3 and SiO 2 And pre-fired, wet pulverized, thus produced barium feldspar compound as the third ceramic: BaAl 2 Si 2 o 8 of powder.

[0164] Next, the glasses shown in Table 1, MgAl 2...

experiment example 3

[0211] In Experimental Example 3, for each of the low-permittivity ceramic layer and the high-permittivity ceramic layer, the influence on the characteristics of each of the low-permittivity ceramic layer and the high-permittivity ceramic layer was investigated when they were made into a co-sintered body. r And the influence of the capacitance temperature coefficient β. exist Image 6 (A) and Image 6 In (B), two types of co-sintered bodies 71 and 72 produced in this experimental example are shown in cross-sectional views, respectively.

[0212] Image 6 The co-sintered body 71 shown in (A) has a structure in which a low dielectric constant ceramic layer 73 with a thickness of 10 μm is sandwiched between two high dielectric constant ceramic layers 74 and 75 with a thickness of 0.5 mm. Between the low dielectric constant ceramic layer 73 and each high dielectric constant ceramic layer 74, 75, internal electrodes 76 and 77 are formed to face each other in a part, and internal...

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Abstract

Provided is a composite multilayer ceramic electronic component which is provided with a co-fired low-permittivity ceramic layer and high-permittivity ceramic layer and in which respectively befitting properties are obtained in the low-permittivity ceramic layer and high-permittivity ceramic layer. The low-permittivity ceramic layer (3) and the high-permittivity ceramic layer (4) are constituted of glass ceramics including: a first ceramic comprising MgAl2O4 and / or Mg2SiO4; a second ceramic comprising BaO, RE2O3 (RE being a rare earth element), and TiO2; glass each including 44.0-69.0 wt% of RO (where R is an alkaline earth metal), 14.2-30.0 wt% of SiO2, 10.0-20.0 wt% of B2O3, 0.5-4.0 wt% of Al2O3, 0.3-7.5 wt% of Li2O, and 0.1-5.5 wt% of MgO; and MnO; the content ratios of the glass and the like in the low-permittivity ceramic layer (3) and the high-dielectric constant ceramic layer (4) being different from each other.

Description

technical field [0001] The present invention relates to a multilayer ceramic electronic component such as a multilayer ceramic substrate constituting a microwave resonator, a filter, or a capacitor, and more particularly to a multilayer ceramic electronic component comprising a layer of low-permittivity ceramic layers having a relatively low relative permittivity and A composite laminated ceramic electronic component having a composite structure of high-permittivity ceramic layers having a relatively high relative permittivity. Background technique [0002] In recent years, along with miniaturization, weight reduction, and thinning of electronic equipment, miniaturization of electronic components used in electronic equipment has been demanded. However, conventionally, electronic components such as capacitors and resonators have been individually configured, and there has been a limit to the miniaturization of electronic equipment only by reducing the size of these components...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/462C04B35/20C04B35/443H01G4/30H01G4/12H01G4/40
CPCC04B2235/3206C04B2237/343C04B2237/62C04B2235/36H01L2924/19105C04B35/443H01G4/40H01G4/129C04B2235/3215H01G4/1218H01L2224/16225C04B35/462C04B2235/3281H01L2924/19041C04B2235/3222H01L2924/15192C04B2237/346C04B2235/3445C04B2235/3232C04B2235/3262H01G4/12H01L2924/1531H01G4/30C04B2237/341C04B2235/3481H01L23/552B32B18/00C04B2235/3224C04B35/20H01G4/1209C03C3/064C03C12/00C03C14/004H01G4/105
Inventor 藤田诚司足立大树金子和广足立聪坂本祯章
Owner MURATA MFG CO LTD
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