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Connection method using anisotropic conductive material and anisotropic conductive connected structure

An anisotropic, conductive material technology, used in the manufacture of electrical solid devices, semiconductor devices, semiconductor/solid state devices, etc., can solve the problems of higher connection resistance, lower connection reliability, larger particle repulsion, etc. Low resistance value, improved connection reliability, and small particle repelling effects

Active Publication Date: 2014-11-12
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in this case, since the above-mentioned first gold protruding electrode and the above-mentioned second gold protruding electrode are directly adhered, it is not foreseeable that the use of the above-mentioned anisotropic conductive material will still leave conductive particles buried in the terminal, and the conductivity The collapse of the particles cannot be sufficiently carried out, and the initial connection resistance value of the anisotropic conductive connection becomes high, and the connection reliability decreases, and the particle repulsion increases, and the connection reliability during the anisotropic conductive connection decreases. question

Method used

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  • Connection method using anisotropic conductive material and anisotropic conductive connected structure
  • Connection method using anisotropic conductive material and anisotropic conductive connected structure
  • Connection method using anisotropic conductive material and anisotropic conductive connected structure

Examples

Experimental program
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Effect test

Embodiment 1

[0204]

[0205] 30 parts by mass of phenoxy resin (trade name: PKHH, manufactured by Fenokishia Socie Co., Ltd.) as the above-mentioned film-forming resin, and naphthalene-type epoxy resin (trade name: HP4032DD, manufactured by DIC Corporation) as the above-mentioned thermosetting resin. 30 parts by mass, 30 parts by mass of an imidazole curing agent (trade name: Nobakyua 3941HP, manufactured by Asahi Kasei Materials Co., Ltd.) as the above-mentioned curing agent, and 30 parts by mass of a silane coupling agent (trade name: A-187, manufactured by Momentive Paphormans Materials Co., Ltd. 35 parts by mass of the above-mentioned conductive particles 1 were dispersed in an adhesive having a composition of 1 part by mass (manufactured) to obtain an ethyl acetate-toluene mixed solution with a nonvolatile content of 50% by mass.

[0206] Next, this mixed solution was coated on a PET film with a thickness of 50 μm, and then dried in an oven at 80° C. for 5 minutes to prepare an aniso...

Embodiment 2～6

[0228] Except that the average thickness of the hard metal portion and the average thickness of the soft metal portion of the terminal of the first electronic component of Example 1 are the average thicknesses described in Table 1-1, anisotropic conductive Joint body, and implement evaluation. The results are shown in Table 1-1.

Embodiment 7

[0242] Except that the conductive particle 1 of Example 1 is used as the above-mentioned conductive particle 2, and the average thickness of the hard metal portion of the terminal of the first electronic component is set to 7.5 μm and the average thickness of the soft metal portion is set to 4.5 μm, and An anisotropic conductive junction body was prepared in the same manner as in Example 1, and evaluated. The results are shown in Table 1-2.

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Abstract

This anisotropic connected structure connects terminals of a first electronic component and terminals of a second electronic component via an anisotropic conductive material. In the anisotropic connected structure, the terminals of the first electronic component have a hard metal part and a soft metal part that is softer than the hard metal part. The anisotropic conductive material has conductive particles, and the soft metal part is in contact with the conductive particles. The hard metal part is in contact with wiring of the first electronic component, and the hardness of the hard metal part is Hv 100 - 650. The hardness of the soft metal part is Hv 10 - 100. The hardness of the conductive particles is 5,880 N / mm2 - 26,460 N / mm2.

Description

technical field [0001] The present invention relates to a connection method and an anisotropic conductive junction using an anisotropic conductive material. Background technique [0002] At present, as a means of connecting electronic parts and substrates, a strip-shaped connecting material (for example, anisotropic conductive film (ACF: Anisotropic Conductive Film) coated with a thermosetting resin dispersed with conductive particles on a release film is used. ) and other anisotropic conductive materials). [0003] For example, this anisotropic conductive material is mainly used to connect the terminal of a flexible printed circuit board (FPC) or an IC chip to an (ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel. A case where various terminals are bonded to each other and electrically connected at the same time. [0004] In recent years, electronic components have continued to be miniaturized and integrated. Therefore, in the electrodes includ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H05K3/22
CPCH01L2224/8185H01L2224/29357H01L2224/13139H01L2224/83855H01L24/29H01L2224/13164H01L2224/75301H01L2224/1316H01L2224/13144H01L2224/83907H05K3/323H01L2224/29311H01L2224/81903H01L24/16H01L2224/29371H01L2224/13155H01L24/13H01L2224/29355H01L2224/13147H01L2224/131H01L2224/13171H01L2224/1146H01L2224/13109H01L2224/75252H01L2224/29347H01L24/83H01L2224/2929H01L2224/9211H01L2224/27436H01L2224/32225H01L2224/1132H01L24/92H01L2224/29324H01L2224/29316H01L2224/1301H01L24/11H01L2224/2936H01L2224/83203H01L2224/83192H01L2224/13166H01L2224/83851H01L2224/2939H01L2224/13082H01L2224/81193H01L2224/294H01L2224/13124H01L24/27H01L2224/75312H01L24/32H01L2224/16238H01L2224/13023H01L24/81H01L2924/15788H01L2924/381
Inventor 工藤克哉
Owner DEXERIALS CORP
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