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A hyperspectral detection integrated module and its manufacturing method

A technology for integrating modules and manufacturing methods, applied in the field of spectral imaging, can solve problems such as inapplicability, inability to modularize integration, and limited field of view, and achieve the effects of shortening production costs, shortening design cycles, and simplifying complexity

Active Publication Date: 2016-09-28
ACAD OF OPTO ELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the spectroscopic element is located between the collimator lens and the imaging lens, which cannot be modularly integrated; at the same time, the physical characteristics of the AOTF crystal limit the field of view of the spectral detection system, so this technology is not suitable for large-field spectral imaging detection environmental requirements; moreover, the AO module adds complexity and volume
[0009] In addition, the current spectral imaging detection technology almost all adopts the method of separating the spectroscopic element and the detector. The spectral imaging detection technology using LCTF and AOTF also needs an additional voltage module or acousto-optic transducer module. The system has high complexity, large volume, and Poor immunity and narrow scope of application, unable to perform modular integration

Method used

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  • A hyperspectral detection integrated module and its manufacturing method
  • A hyperspectral detection integrated module and its manufacturing method
  • A hyperspectral detection integrated module and its manufacturing method

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Experimental program
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Embodiment 1

[0029] image 3 It is a schematic structural diagram of a hyperspectral detection integrated module provided by Embodiment 1 of the present invention. Such as image 3 As shown, it mainly includes: glass fixed fins 11, outer cover 12, CCD (charge coupled device) chip ceramic base 13, CCD front 14 and multi-channel or linear gradient filter 15;

[0030] Wherein, there is a groove in the ceramic base 13 of the CCD chip, and the bottom of the groove is provided with a CCD front 14; the multi-channel or linear gradient filter 15 is fixed 11 on the outer cover 12 by the glass fixing fins. Above, the outer cover 12 and the upper surface of the CCD chip ceramic base 13 are glued and sealed by resin 16; The distance is less than the preset value.

[0031] Further, after the outer cover 12 and the upper surface of the CCD chip ceramic base 13 are bonded and sealed with resin 16 , inert gas is injected or vacuumed 17 through the ventilation hole on the outer cover.

[0032] in addit...

Embodiment 2

[0040] An embodiment of the present invention provides a method for manufacturing a hyperspectral detection integrated module, the method comprising:

[0041] Process a groove template according to the size of the ceramic base of the CCD chip. Based on the groove template, the two ends of the multi-channel or linear gradient filter are respectively glued to the glass fixing wing, and the glass fixing wing is fixed on the on the cover;

[0042] The outer cover is installed on the upper surface of the ceramic base of the CCD chip, and sealed by resin glue; wherein, the multi-channel or linear gradient filter extends into the groove of the ceramic base of the CCD chip and is connected with the ceramic base of the CCD chip. The distance between the CCD front arranged at the bottom of the ceramic base of the CCD chip is smaller than a preset value.

[0043] For ease of understanding, the following is combined with the Figure 4-Figure 7 The present invention will be further descr...

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Abstract

The invention discloses a hyperspectral detection integrated module and a manufacture method thereof. The module comprises a glass fixed wing strip, an outer cover, a charge-coupled device (CCD) chip ceramic pedestal, a CCD array plane and a multichannel or a linearity gradual change optical filter. The CCD chip ceramic pedestal is internally provided with a groove, the bottom of the groove is provided with the CCD array plane, the multichannel or the linearity gradual change optical filter are fixed on the outer cover through the glass fixed wing strip, the outer cover and the upper surface of the CCD chip ceramic pedestal are bonded and sealed through a resin adhesive, the multichannel or the linearity gradual change optical filter extends into the groove, and the distance between the multichannel or the linearity gradual change optical filter and the CCD array plane is smaller than a preset value. By using the hyperspectral detection integrated module and the manufacture method thereof, disclosed by the invention, the complexity of a spectrum imaging detection system is simplified, the design period and the production cost of the system are reduced, and the module integration is improved.

Description

technical field [0001] The invention relates to the technical field of spectral imaging, in particular to a hyperspectral detection integrated module and a manufacturing method thereof. Background technique [0002] With the advancement of modern precision instrument technology and the improvement of detection requirements, spectral detection and spectral imaging detection systems are gradually developing towards miniaturization and integration, and the spectral resolution is also getting higher and higher. Spectral imaging detection can be divided into prism spectroscopic type, filter spectroscopic type, grating spectroscopic type and interference type according to different spectroscopic methods. Prism and grating dispersive spectral imagers appeared earlier, and the technology is the most mature. Most spectral imagers use this kind of spectroscopic technology. [0003] Typical applications of prisms and gratings are Figure 1a-Figure 1b The slit is located on the front f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01J3/02G01J3/28
Inventor 柳青张桂峰李杨周志胜周锦松聂云峰
Owner ACAD OF OPTO ELECTRONICS CHINESE ACAD OF SCI