A hyperspectral detection integrated module and its manufacturing method
A technology for integrating modules and manufacturing methods, applied in the field of spectral imaging, can solve problems such as inapplicability, inability to modularize integration, and limited field of view, and achieve the effects of shortening production costs, shortening design cycles, and simplifying complexity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0029] image 3 It is a schematic structural diagram of a hyperspectral detection integrated module provided by Embodiment 1 of the present invention. Such as image 3 As shown, it mainly includes: glass fixed fins 11, outer cover 12, CCD (charge coupled device) chip ceramic base 13, CCD front 14 and multi-channel or linear gradient filter 15;
[0030] Wherein, there is a groove in the ceramic base 13 of the CCD chip, and the bottom of the groove is provided with a CCD front 14; the multi-channel or linear gradient filter 15 is fixed 11 on the outer cover 12 by the glass fixing fins. Above, the outer cover 12 and the upper surface of the CCD chip ceramic base 13 are glued and sealed by resin 16; The distance is less than the preset value.
[0031] Further, after the outer cover 12 and the upper surface of the CCD chip ceramic base 13 are bonded and sealed with resin 16 , inert gas is injected or vacuumed 17 through the ventilation hole on the outer cover.
[0032] in addit...
Embodiment 2
[0040] An embodiment of the present invention provides a method for manufacturing a hyperspectral detection integrated module, the method comprising:
[0041] Process a groove template according to the size of the ceramic base of the CCD chip. Based on the groove template, the two ends of the multi-channel or linear gradient filter are respectively glued to the glass fixing wing, and the glass fixing wing is fixed on the on the cover;
[0042] The outer cover is installed on the upper surface of the ceramic base of the CCD chip, and sealed by resin glue; wherein, the multi-channel or linear gradient filter extends into the groove of the ceramic base of the CCD chip and is connected with the ceramic base of the CCD chip. The distance between the CCD front arranged at the bottom of the ceramic base of the CCD chip is smaller than a preset value.
[0043] For ease of understanding, the following is combined with the Figure 4-Figure 7 The present invention will be further descr...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 