Misplaced Complex Microchannel Micro Heat Exchanger
A micro-channel and heat exchanger technology, which is applied in the direction of electric solid devices, semiconductor devices, semiconductor/solid device components, etc., to achieve the effects of reducing pressure drop, improving heat exchange, and improving uniformity
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Embodiment 1
[0045] With the rapid development of information technology and electronic technology, the power of electronic chips has increased dramatically, and effective heat dissipation has become a crucial issue in the development of chips. The misplaced fan-shaped groove microchannel micro heat exchanger is composed of a substrate 2 and an encapsulation sheet 1 with complex channels, see figure 1 with figure 2 . The substrate is made of silicon, the package is made of glass, and the working medium is deionized water. Because the cost of high-power chips is very expensive, in this embodiment, a thin-film heat source is used instead of chips for new energy testing. The thin-film heat source adopts platinum metal heating film. After optimization of microelectronics circuit design, the platinum heating film can generate heat evenly to simulate the heat dissipation of electronic chips. The input voltage of platinum heating film is determined according to the heat production of the chip....
Embodiment 2
[0051] The present invention will be further described below in conjunction with the accompanying drawings and the application of the misplaced triangular groove microchannel micro heat exchanger in the heat dissipation of electronic chips:
[0052] With the rapid development of information technology and electronic technology, the power of electronic chips has increased dramatically, and effective heat dissipation has become a crucial issue in the development of chips. The misplaced triangular groove microchannel micro heat exchanger is composed of a substrate 2 and an encapsulation sheet 1 with complex channels. See figure 1 with figure 2 . The substrate is made of silicon, the package is made of glass, and the working medium is deionized water. Because the cost of high-power chips is very expensive, in this embodiment, a thin-film heat source is used instead of chips for new energy testing. The thin-film heat source adopts platinum metal heating film. After optimization...
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