Tin enameling treatment method

A treatment method, tin pot technology, applied in coating, metal material coating process, hot-dip plating process, etc., can solve problems such as "golden brittleness" and achieve good consistency

Inactive Publication Date: 2014-12-03
XIAN SANWEI SECURITY TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The gold-plated surface treatment method solves the problem of anti-oxidation very well, but t...

Method used

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Embodiment Construction

[0013] A kind of enamel processing method of the present invention is characterized in that comprising the following steps:

[0014] (1) First, deoxidize the lead wire, and then wrap the root with gauze;

[0015] (2) Then immerse the gold-plated lead wire coated with flux in the special tin pot for enamel tinning for 2s~3s, and keep the temperature between 250℃~270℃;

[0016] (3) Then immerse the lead wire in an ordinary tin pot for secondary tinning, the time is 2s~3s, and the temperature is kept between 250℃~270℃.

[0017] In the tin enamel treatment method described in the present invention, the wrapping length of the lead wire in the step (1) is 5 mm to 10 mm. In the step (2), the content of gold impurities in the solder in the enamelled tin pot is not less than or equal to 1%. The gold impurity content of the solder in the step (3) is less than or equal to 0.3%. The lead wire deoxidization in the step (1) is treated by heating or grinding with sandpaper.

[0018] The...

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PUM

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Abstract

The invention discloses a tin enameling treatment method, and belongs to the field of chemical treatment processes. The tin enameling treatment method is characterized by comprising the following steps: (1) the root of a lead is wrapped by a gauze; and (2) a gold plating lead coated with soldering flux is dipped for 2-3 s in a special tin pot for tin enameling; and the temperature is kept within 250-270 DEG C; and (3) the lead is dipped in a general tin pot again for secondary tin enameling; and the time and temperature are the same with that of the tin pot in the step (1). The static tin dipping is performed for a tin enameling circuit board by adopting double tin pots, and the tin enameling operation is finished more thoroughly through twice heat impact under the precondition of no mechanical damage, so that the consistency is good; and the tin enameling treatment method has the advantages of simple process and easy promotion.

Description

technical field [0001] The invention belongs to the field of chemical treatment technology, and in particular relates to a tin enamel treatment method. Background technique [0002] Gold is widely used in the electronics industry because of its advantages such as good chemical stability, not easy to oxidize, good welding performance, wear resistance, good electrical conductivity and small contact resistance. The role of gold is to protect the surface of the fresh nickel layer and prevent it from oxidizing, thereby improving solderability. This method is mostly used in the pad plating of printed boards and the lead plating of electronic components. The gold-plated surface treatment method solves the problem of anti-oxidation well, but there is also a certain reliability problem in welding, that is, the phenomenon of "gold brittleness". In recent years, more and more attention has been paid to the embrittlement and insufficient strength of solder joints caused by "golden br...

Claims

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Application Information

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IPC IPC(8): C23C2/08C23C2/38
Inventor 贾卫东魏军锋
Owner XIAN SANWEI SECURITY TECH
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