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Active agent for lead-free solder paste, preparation method thereof and lead-free solder paste

A technology of lead-free solder paste and activator, which is applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of intolerance to storage and low activity, reduce the amount of use, improve printing durability, and prolong the storage time at room temperature Effect

Active Publication Date: 2014-12-10
HOERSON ELECTRONICS TECH +1
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  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide an activator for lead-free solder paste and a preparation method thereof and a kind of lead-free solder paste, aiming to solve the problem of low activity of the current lead-free solder paste due to the activator. , the problem of intolerance to storage

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  • Active agent for lead-free solder paste, preparation method thereof and lead-free solder paste
  • Active agent for lead-free solder paste, preparation method thereof and lead-free solder paste
  • Active agent for lead-free solder paste, preparation method thereof and lead-free solder paste

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Embodiment Construction

[0023] The present invention provides an active agent for lead-free solder paste, its preparation method and a lead-free solder paste. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] The present invention provides a kind of preparation method of active agent for lead-free solder paste, wherein, described preparation method is:

[0025] After the organic acid and organic halide particles are crushed to a particle size below 10 μm, they are added to the wall material solution and fully emulsified to make microcapsule active particles as active agents for lead-free solder paste.

[0026] In a preferred embodiment, the organic acid is composed of a dicarboxylic acid with 4 to 10 even-numbered C atoms ...

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Abstract

The invention discloses an active agent for lead-free solder paste, a preparation method of the active agent for the lead-free solder paste and the lead-free solder paste. The preparation method of the active agent for the lead-free solder paste comprises the steps that organic acid and organic halide particles are smashed into particles with the size smaller than 10 microns, and the particles are added to capsule wall material solutions to be fully emulsified and are made into microcapsule active particles as the active agent for the lead-free solder paste. The active agent for the lead-free solder paste is prepared based on the microcapsulary, the printing durability of the solder paste is greatly improved, and the room temperature storage time of the solder paste is prolonged. Compared with an existing solder paste active agent, through the segmentation activity releasing characteristic of the active agent, the solder paste is made to have better wettability, the use amount of the solder paste can be reduced, and the quantitative control over solder feeding and the solder paste wetting effect is achieved.

Description

technical field [0001] The invention relates to the field of soldering technology, in particular to an activator for lead-free solder paste, a preparation method thereof and a lead-free solder paste. Background technique [0002] In the current solder paste process, the most critical technology is to maintain the maximum activity of the solder paste without compromising other properties of the solder paste. However, the current solder paste generally suffers from increased activity, increased corrosion, reduced reliability, and residual color. In addition, the fluidity of the solder paste is enhanced, and the problem of increased solder balls is also generated. [0003] In the existing solder paste technology, the components used as active agents mainly include organic acids, organic acid salts, and organic halides. However, the activity of organic acids is too low, it is difficult to clean, and there is a peculiar smell when they evaporate, and organic acid salts are easy t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/3612B23K35/362B23K35/40
Inventor 马鑫任晓敏
Owner HOERSON ELECTRONICS TECH
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