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Method for preparing aln green ceramic sheet for multilayer wiring substrate by tape casting method and prepared aln green ceramic sheet

A multi -layer wiring substrate and flowing technology, which is applied in the field of Aln raw porcelain and its current preparation. Effect

Active Publication Date: 2016-01-20
HEFEI SHENGDA ELECTRONIC TECH IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thickness of the tape-cast green ceramic sheet produced by this process is generally more than 0.3mm. The obtained green ceramic sheet is mainly used to make optical substrates (without metallized lines inside), and is not suitable for the production of multi-layer substrates (with metallized lines inside). need

Method used

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  • Method for preparing aln green ceramic sheet for multilayer wiring substrate by tape casting method and prepared aln green ceramic sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Cast 0.100mm thick green ceramic sheet

[0043] The average particle size of AlN powder is 1.2μm, the specific surface area (BET) is 3.4㎡ / g, the oxygen content is less than 0.9% (weight percent), Y 2 o 3 , CaO powder particle size are in the range of 0.8 ~ 3.0μm.

[0044] In this example, the ingredients are prepared according to the following proportions:

[0045] AlN powder weight percentage is 47%

[0046] The weight percentage of sintering aid is 2.5%

[0047] The weight percentage of dispersant is 0.95%

[0048] Binder weight percentage is 8.5%

[0049] Multicomponent solvent weight percentage is 37.3%

[0050] Plasticizer percentage is 3.75%

[0051] 1) Prepare a 3.5kg batch for casting. Weigh the dispersant, sintering aid and multi-component solvent according to the above ratio. The solvents are mixed and poured into a ball mill jar, and then the sintering aid and the dispersant are respectively added to the multi-component solvent and stirred. Carry ou...

Embodiment 2

[0066] Cast 0.168mm thick green ceramic sheet

[0067] The average particle size of AlN powder is 1.2μm, the specific surface area (BET) is 3.4㎡ / g, the oxygen content is less than 0.9% (weight percent), Y 2 o 3 , CaO powder particle size are in the range of 0.8 ~ 3.0μm.

[0068] In this example, the ingredients are prepared according to the following proportions:

[0069] AlN powder weight percentage is 47%

[0070] The weight percentage of sintering aid is 2.5%

[0071] The weight percentage of dispersant is 0.95%

[0072] Binder weight percentage is 8.5%

[0073] Multicomponent solvent weight percentage is 37.3%

[0074] Plasticizer percentage is 3.75%

[0075] 1) Prepare a 3.5kg batch for casting. Weigh the dispersant, sintering aid and multi-component solvent according to the above ratio. Mix the solvents and pour them into the ball mill tank, then add the sintering aid and dispersant to the multi-component solvent and stir, and then perform the first ball mill af...

Embodiment 3

[0089] Cast 0.270mm thick green ceramic sheet

[0090] The average particle size of AlN powder is 1.2μm, the specific surface area (BET) is 3.4㎡ / g, the oxygen content is less than 0.9% (weight percent), Y 2 o 3 , CaO powder particle size are in the range of 0.8 ~ 3.0μm.

[0091] In this example, the ingredients are prepared according to the following proportions:

[0092] AlN powder weight percentage is 48.3%

[0093] The weight percentage of sintering aid is 2.58%

[0094] The percentage of dispersant is 0.97%

[0095] Binder percentage is 5.8%

[0096] Multicomponent solvent weight percentage is 38.4%

[0097] Plasticizer percentage is 3.95%

[0098] 1) Prepare a 7kg batch for casting. Weigh the dispersant, sintering aid and multi-component solvent according to the above ratio. The solvents are mixed and poured into a ball mill jar, and then the sintering aid and the dispersant are respectively added to the multi-component solvent and stirred. Carry out ball millin...

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Abstract

The invention discloses a method for preparing an AlN raw ceramic chip for a multi-layer wiring substrate by virtue of a tape casting process. The method involves a manufacturing method for an AlN multi-layer raw ceramic chip and slurry and a tape casting process. The method comprises the following steps: stirring and uniformly mixing AlN powder, a sintering aid, a dispersing agent, a bonding agent, a plasticizer and a solvent to form slurry; and preparing the raw ceramic chip by virtue of a tape casting process, wherein the thickness of the raw ceramic chip is controlled to less than 0.300mm and the manufactured raw ceramic chip can satisfy manufacturing requirements of the multi-layer wiring substrate.

Description

technical field [0001] The invention relates to the field of new optoelectronic communication materials, which is one of the important fields in the development of electronic ceramic packaging technology, and specifically relates to an AlN green ceramic sheet used in the optoelectronic communication industry and a casting method thereof. Background technique [0002] The increasing multi-functionalization and automation of electronic information, power electronics, semiconductor lasers, photoelectric industries and other equipment requires that the electronic circuit system must have the characteristics of complete functions, small size, light weight, high efficiency, and high power density, thus promoting Related electronic devices are rapidly developing towards high power, high integration and miniaturization. Many products require multi-layer precision circuits to be designed inside the substrate to meet the needs of electronic devices. At the same time, higher requiremen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/581C04B35/622
Inventor 郭军张浩崔嵩党军杰汤文明詹俊耿春磊史常东
Owner HEFEI SHENGDA ELECTRONIC TECH IND CO LTD
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