Solid-liquid method of silicon wafer cutting fluid

A technology of solid-liquid separation and cutting fluid, which is applied in the direction of lubricating compositions, etc., can solve the problems such as the difficulty of separating solid particles such as fine silicon chips, and achieve the effects of low production cost, simple process flow, and accelerated sedimentation speed

Inactive Publication Date: 2014-12-10
KAIFENG WANSHENGXIN MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a method for solid-liquid separation of crystal silicon wafer cutting fluid, which solves the problem that solid particles such as fine silicon scraps in the cutting fluid...

Method used

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  • Solid-liquid method of silicon wafer cutting fluid

Examples

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Effect test

Embodiment 1

[0029] Example 1: A kind of solid-liquid separation method of crystal silicon wafer cutting liquid, see figure 1 , including the following steps:

[0030] (1) pH value adjustment: adjust the pH value of the cutting fluid to be separated to 8.5 to obtain weakly alkaline slurry A;

[0031] (2) Sedimentation and stratification: Let the slurry A stand for 16 hours to allow the solid particles to settle and form stratification with the liquid in it;

[0032] (3) Siphon separation: use siphon to extract the supernatant liquid after sedimentation and stratification, the siphon pressure is 0.03MPa, and separate the supernatant liquid B and the remaining slurry C; the siphon separation method can adopt the lifting siphon method to ensure The siphon is required for the layered interface of different heights, and the siphon tube is a U-shaped tube with an upward opening in the supernatant, which can avoid the inhalation of solid particles in the lower layer;

[0033] (4) Centrifuga...

Embodiment 2

[0039] The crystalline silicon wafer cutting fluid to be separated from solid and liquid is processed in the same manner as in Example 1, the difference being that in the quartz sand filtration process, pressurized filtration is adopted, so that the uniformly mixed liquid is filtered at a filtration pressure of 0.3 MPa. Filtration is performed under pressure through a bed of quartz sand media.

Embodiment 3

[0041] The crystal silicon wafer cutting fluid to be separated from solid-liquid was treated in the same manner as in Example 1, except that: during the adsorption process, an adsorbent was added to the filtrate E, and its pH value was adjusted to 6.

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Abstract

The invention relates to a solid-liquid method of silicon wafer cutting fluid, aiming to solve the problem that fine solid particles in the cutting fluid are difficult to separate. The solid-liquid method comprises the following steps: firstly regulating the pH value of the cutting fluid to 8-9, then standing for 10-20 hours for settlement and layering, then performing siphon separation to obtain supernatant under siphon pressure of 0.01-0.05MPa, evenly mixing the supernatant together with a liquid which is obtained from centrifugally separating lower-layer slurry at high speed, leading the obtained mixture to quartz sand for filtering, then adding an adsorbant for adsorption, performing pressure filtering and ultrafiltration to finally realize the solid-liquid separation of the cutting fluid. The method has the characteristics that the separation of solid and liquid is thorough and the separated cutting fluid can be repeatedly used, the generation of reactive gas in a chemical separation method and the adverse effect on the environment and production safety can be avoided.

Description

technical field [0001] The invention relates to a solid-liquid separation method for crystal silicon wafer cutting fluid, which is applied in the technical field of crystal silicon wafer cutting fluid production. Background technique [0002] The cutting fluid mainly plays the role of lubrication, cooling, and dispersion during the cutting process. It is widely used in the wire saw cutting industry such as solar crystal silicon wafers. If it is used together with a high-speed wire saw, it can cut the crystal ingot into pieces. However, with the continuous cutting of crystalline silicon wafers and the recycling of cutting fluid, solid impurities such as silicon shavings will continue to be mixed into the cutting fluid, which will affect its performance. After accumulating to a certain extent, it cannot continue to be used. In order to ensure the cutting performance of the cutting fluid, measures must be taken to separate the solids such as silicon shavings particles mixed in...

Claims

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Application Information

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IPC IPC(8): C10M175/00
Inventor 张赛李森张冬林王天虎
Owner KAIFENG WANSHENGXIN MATERIALS
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