Solid-liquid method of silicon wafer cutting fluid

Abstract

The invention relates to a solid-liquid method of silicon wafer cutting fluid, aiming to solve the problem that fine solid particles in the cutting fluid are difficult to separate. The solid-liquid method comprises the following steps: firstly regulating the pH value of the cutting fluid to 8-9, then standing for 10-20 hours for settlement and layering, then performing siphon separation to obtain supernatant under siphon pressure of 0.01-0.05MPa, evenly mixing the supernatant together with a liquid which is obtained from centrifugally separating lower-layer slurry at high speed, leading the obtained mixture to quartz sand for filtering, then adding an adsorbant for adsorption, performing pressure filtering and ultrafiltration to finally realize the solid-liquid separation of the cutting fluid. The method has the characteristics that the separation of solid and liquid is thorough and the separated cutting fluid can be repeatedly used, the generation of reactive gas in a chemical separation method and the adverse effect on the environment and production safety can be avoided.

Description

technical field [0001] The invention relates to a solid-liquid separation method for crystal silicon wafer cutting fluid, which is applied in the technical field of crystal silicon wafer cutting fluid production. Background technique [0002] The cutting fluid mainly plays the role of lubrication, cooling, and dispersion during the cutting process. It is widely used in the wire saw cutting industry such as solar crystal silicon wafers. If it is used together with a high-speed wire saw, it can cut the crystal ingot into pieces. However, with the continuous cutting of crystalline silicon wafers and the recycling of cutting fluid, solid impurities such as silicon shavings will continue to be mixed into the cutting fluid, which will affect its performance. After accumulating to a certain extent, it cannot continue to be used. In order to ensure the cutting performance of the cutting fluid, measures must be taken to separate the solids such as silicon shavings particles mixed in...

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for solid-liquid separation of crystal silicon wafer cutting fluid, which solves the problem that solid particles such as fine silicon scraps in the cutting fluid are difficult to separate, and at the same time avoids the generation of reaction gas, and has the advantages of thorough solid-liquid separation, The feature that the separated cutting fluid can be reused

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