Resin composition for reflecting light, substrate for mounting optical semiconductor element, and optical semiconductor device
A resin composition, light reflection technology, applied in semiconductor devices, electrical components, electric solid devices, etc., can solve the problems of low heat resistance, difficult molding, cracks, etc., and achieve the effect of excellent reliability
Inactive Publication Date: 2014-12-10
SUMITOMO BAKELITE CO LTD
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- Summary
- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0004] However, currently used resin compositions for light reflection have low moldability, making it difficult to mold them into desired shapes.
In addition, the conventional resin composition for light reflection has low heat resistance, and there is a problem that the reflectance decreases due to yellowing due to heat during molding, heat during soldering, heat from light-emitting elements, etc.
In addition, there is also a problem of peeling and cracking of the light reflection member due to heat.
Method used
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Embodiment 1～13
[0132] Each component shown in Table 1 was uniformly mixed at 10-50 degreeC using the mixer.
[0133] Thereafter, the resin composition for light reflection was obtained by performing melt kneading using a kneader, followed by cooling and pulverization.
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Abstract
This resin composition for reflecting light contains a colorant and an epoxy resin (B) containing a unit structure (X) which is an alicyclic anhydride and a unit structure (Y) which is a hydrogenated bisphenol. The epoxy resin (B) preferably also contains a unit structure (Z) which is a bisphenol epoxy. This resin composition for reflecting light preferably also contains an epoxy resin (A) having a structure expressed by the formula (1). Furthermore, if the amount of the epoxy resin (A) is M (mass %), and the amount of the epoxy resin (B) is N (mass %), preferably the relationship 0.1 <= M / N <= 10 is satisfied. (In formula (1), R represents a monovalent organic group with 2 to 10 carbon atoms, and n represents an integer from 3 to 50.)
Description
technical field [0001] The present invention relates to a resin composition for light reflection, a substrate for mounting an optical semiconductor element, and an optical semiconductor device. Background technique [0002] Currently, in an optical semiconductor device or the like including a light emitting element such as an LED (Light Emitting Diode), in order to effectively utilize the light emitted from the light emitting element, a light reflecting member (such as a white film, a white coating film, silver film, silver coating, etc.) to achieve improved reflectivity. [0003] Such a light reflection member is generally composed of a resin composition (resin composition for light reflection) containing a resin, a curing agent, a colorant, and the like (for example, refer to Patent Document 1). [0004] However, currently used resin compositions for light reflection have low moldability, making it difficult to mold them into desired shapes. In addition, conventional lig...
Claims
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IPC IPC(8): C08G59/32C08K3/22C08L63/00H01L33/60
CPCH01L33/641C08K3/22H01L33/60C08G59/32C08L63/00H01L2933/0033C08G59/3218C08G59/3236C08L2205/02C08L2205/03H01L2224/48091H01L2224/73265C08G59/38C08K3/36C08L2203/20C08L2205/025C08L63/06H01L2924/00014
Inventor 伊东昌治作道庆一
Owner SUMITOMO BAKELITE CO LTD