Laser processing device

Abstract

PROBLEM TO BE SOLVED: To provide a laser processor having a confirmation function of the operation of focal point position adjusting means following the upper-face height position information of a processed object.SOLUTION: A laser processor 1 comprises: laser light radiation means 8 having an objective condenser lens 65 for irradiating a processed object with laser radiation; height position detection means 6 which detects an upper-face height position of the processed object; focal point position adjusting means 650 which moves an objective condenser lens to a Z-axial direction; processing / sending means 37 of a chuck table 36 to an X-axial direction; X-axial position detection means 374 which detects an X-axial position of the chuck table; and control means 9. The control means comprises storage means which stores a processed object height position measurement value which is measured while moving the processed object to the X-axial direction and an X-coordinate based on the X-axial position detection means, controls the focal point position adjusting means on the basis of the height measurement value of the X-coordinate which is stored in the storage means while moving the processed object to the X-axial direction, and displays height information obtained by the height position detection means at display means in association with the X-axial direction.

Description

technical field [0001] The present invention relates to a laser processing apparatus having a function of detecting the height position of an upper surface of a workpiece held by a chuck table holding the workpiece. Background technique [0002] In the manufacturing process of semiconductor devices, a plurality of regions are divided on the surface of a substantially disk-shaped semiconductor wafer by dividing lines arranged in a grid, and devices such as ICs and LSIs are formed in the divided regions. Then, the semiconductor wafer is cut along the lanes, whereby the regions where the devices are formed are divided to manufacture individual semiconductor devices. In addition, a light-emitting layer composed of an n-type semiconductor layer and a p-type semiconductor layer is laminated on the surface of a substantially disc-shaped sapphire substrate, silicon carbide substrate, gallium nitride substrate, etc. Optical devices such as light-emitting diodes and laser diodes are ...

AI Technical Summary

Problems solved by technology

[0010] Moreover, even if the focal point position adjustment member is operated according to the height position information of the upper surface of the workpiece held by the chuck table, sometimes it cannot follow the height position information and the operation is slightly delayed, and the focal point of the laser beam cannot be positioned. to the correct position and the problem of deterioration of machining accuracy

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