Polishing pad finisher, polishing pad finishing device and polishing system

A dressing device and polishing pad technology, applied in the field of chemical mechanical polishing (CMP), can solve the problems of reducing the service life of the dresser 1, scratching silicon wafers, easy peeling, etc., and achieving the effect of reducing the possibility of peeling and reducing the frequency of use

Active Publication Date: 2014-12-17
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this trimmer 1 is located at the outer edge position ( figure 1 The diamond abrasive particles 3 shown in the dotted line circle A), and the position at the inner edge ( figure 1 The diamond abrasive particles 3 at the position i

Method used

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  • Polishing pad finisher, polishing pad finishing device and polishing system
  • Polishing pad finisher, polishing pad finishing device and polishing system
  • Polishing pad finisher, polishing pad finishing device and polishing system

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Embodiment Construction

[0037] The inventor has found through research that one of the reasons why the diamond abrasive grains at the edge position are easy to peel off is: as figure 1 As shown, in the process of using the dresser 1 to dress the polishing pad, the outer edge position ( figure 1 The diamond abrasive grains 3 at the position indicated by the dotted line circle A) have a relatively large linear velocity, so they are easily subjected to a large shear force; , therefore, when using the dresser 1 to dress the polishing pad, no matter how much the indentation depth of the dresser 1 into the polishing pad is, all the diamond abrasive particles 3 on the grinding surface S1 will grind the polishing pad, increasing the outer edge position The frequency of use of the diamond abrasive grains 3 causes the diamond abrasive grains 3 at the outer edge to peel off easily.

[0038] The second reason why the diamond abrasive particles at the edge are easy to peel off is: continue to refer to figure 1 ...

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PUM

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Abstract

Provided are a polishing pad finisher, a polishing pad finishing device and a polishing system. The finisher comprises abrasive particles and a base body with a grinding face, wherein the abrasive particles firmly solidify on the grinding face, the grinding face comprises an edge grinding face and a central grinding face which are connected, and the edge grinding face surrounds the central grinding face. The central grinding face is a plane and is higher than the edge grinding face. When a polishing pad is finished and due to the fact that the central grinding face of the grinding face is higher than the edge grinding face, the abrasive particles on the edge grinding face are higher than the abrasive particles on the central grinding face. Therefore, when the pressing depth of the polishing pad finisher extending into the polishing pad is small, most of the abrasive particles on the edge grinding face do not perform grinding, the using frequency of the abrasive particles located at the edge position is reduced, and scaling possibility of the abrasive particles located at the edge position is reduced. In addition, the possibility that the abrasive particles located at the edge position bump with the edge of the polishing pad is further reduced.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical polishing (CMP), and in particular relates to a polishing pad dresser, a polishing pad dressing device including the polishing pad dresser, and a polishing system including the polishing pad dressing device. Background technique [0002] Chemical mechanical polishing (CMP) technology is one of the key technologies for semiconductor wafer surface processing, and it is used for surface planarization at various stages of integrated circuit manufacturing process, and has been widely used in recent years. During the chemical mechanical polishing process, the polishing pad has the functions of storing, transporting the polishing liquid, removing processing residues, transmitting mechanical loads and maintaining the polishing environment. As the chemical mechanical polishing process continues, the physical and chemical properties of the polishing pad will change, manifested as residual substa...

Claims

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Application Information

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IPC IPC(8): B24B53/017B24B53/12
CPCB24B53/017B24B53/12B24B37/34
Inventor 姚力军大岩一彦相原俊夫潘杰王学泽
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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