Polishing pad finisher, polishing pad finishing device and polishing system

Abstract

Provided are a polishing pad finisher, a polishing pad finishing device and a polishing system. The finisher comprises abrasive particles and a base body with a grinding face, wherein the abrasive particles firmly solidify on the grinding face, the grinding face comprises an edge grinding face and a central grinding face which are connected, and the edge grinding face surrounds the central grinding face. The central grinding face is a plane and is higher than the edge grinding face. When a polishing pad is finished and due to the fact that the central grinding face of the grinding face is higher than the edge grinding face, the abrasive particles on the edge grinding face are higher than the abrasive particles on the central grinding face. Therefore, when the pressing depth of the polishing pad finisher extending into the polishing pad is small, most of the abrasive particles on the edge grinding face do not perform grinding, the using frequency of the abrasive particles located at the edge position is reduced, and scaling possibility of the abrasive particles located at the edge position is reduced. In addition, the possibility that the abrasive particles located at the edge position bump with the edge of the polishing pad is further reduced.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical polishing (CMP), and in particular relates to a polishing pad dresser, a polishing pad dressing device including the polishing pad dresser, and a polishing system including the polishing pad dressing device. Background technique [0002] Chemical mechanical polishing (CMP) technology is one of the key technologies for semiconductor wafer surface processing, and it is used for surface planarization at various stages of integrated circuit manufacturing process, and has been widely used in recent years. During the chemical mechanical polishing process, the polishing pad has the functions of storing, transporting the polishing liquid, removing processing residues, transmitting mechanical loads and maintaining the polishing environment. As the chemical mechanical polishing process continues, the physical and chemical properties of the polishing pad will change, manifested as residual substa...

AI Technical Summary

Problems solved by technology

However, this trimmer 1 is located at the outer edge position ( figure 1 The diamond abrasive particles 3 shown in the dotted line circle A), and the position at the inner edge ( figure 1 The diamond abrasive particles 3 at the position indicated by the dotted line circle B) are easy to peel off, which not only reduces the service life of the dresser 1, but also the peeled diamond abrasive particles 3 will cause scratches to the polished silicon wafer above the polishing pad

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