Infrasonic sensor

A technology of induction device and infrasonic wave, which is applied in the direction of measuring device, measuring ultrasonic/sonic wave/infrasonic wave, and adopting electric device, etc. It can solve the problems of difficult frequency response, unresponsive infrasonic wave, and bulky flat device, etc., to achieve simple structure and high sensitivity High, good conductivity

Inactive Publication Date: 2014-12-24
CHONGQING JIAZE MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The common problems of other types of sensors are low sensitivity, not easy to flat frequency response and bulky devices, etc.
[0003] At present, the infrasonic wave monitoring device is limit...

Method used

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  • Infrasonic sensor

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Embodiment Construction

[0014] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0015] Such as figure 1 As shown, an infrasonic wave induction device includes a metal casing 1, a wire mesh cover 4 is arranged inside the top of the metal casing 1, a conical resonant disk 6 is arranged under the wire mesh cover 4, and the conical resonance A piezoelectric wafer 7 is arranged below the disk 6, and the piezoelectric wafer 7 is arranged on the wafer installation structure 3, and the wafer installation structure 3 is arranged on the bracket 9, and the bracket 9 is arranged on the bottom of the metal casing 1. The bottom end of the metal shell 1 is provided with an anode lead terminal 11 and a cathode lead terminal 10. The anode lead terminal 11 and the cathode lead terminal 10 are respectively provid...

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Abstract

The invention relates to an infrasonic sensor comprising a metal shell. A metal wire enclosure is arranged on the inner side of the top end of the metal shell. A tapered resonant disc is arranged under the metal wire enclosure. A piezoelectric chip is arranged under the tapered resonant disc above a chip mounting structure; the chip mounting structure is arranged on a bracket; the bracket is arranged at the bottom of the metal shell; an anode lead terminal and a cathode lead terminal are arranged at the bottom end of the metal shell and provided with an anode lead and a cathode lead respectively; the anode lead and the cathode lead are both connected with the piezoelectric chip. The infrasonic sensor is simple in structure, small in size, high in sensitivity and well responsive to low-frequency infrasound.

Description

technical field [0001] The invention relates to an acoustic wave monitoring device, in particular to an infrasonic wave induction device. Background technique [0002] Most domestic infrasound observation stations use capacitive infrasound sensors. Now this kind of capacitive infrasound sensor has been widely used in research fields such as hail forecast, earthquake infrasound forecast and geophysics. Common problems with other types of sensors are low sensitivity, not flat frequency response, and bulky devices. For example, the electrodynamic infrasonic sensor is mass-controlled, and its lower frequency limit is determined by the mass. In order to obtain a sufficiently low lower limit frequency, the vibration system is required to have a large enough mass and compliance, so the system must be very bulky. [0003] At present, the infrasonic wave monitoring device is limited by the limitation of the material itself, which mainly shows that it cannot respond to infrasonic wa...

Claims

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Application Information

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IPC IPC(8): G01H11/08
Inventor 李杰
Owner CHONGQING JIAZE MACHINERY
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