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cutting device

A cutting device and chuck table technology, which is applied in the manufacturing of fine working devices, electrical components, semiconductor/solid-state devices, etc., can solve the problems of expensive cutting devices and complex structures, and achieve low cost, simplified structure, and economical savings. effect of space

Active Publication Date: 2018-07-31
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the cutting device disclosed in Patent Document 1, the structure of the transport member for transporting the divided chips from the chuck table becomes complicated, and it is required to securely attract and fix the chip to the transport member.
Therefore, the cutting device itself is relatively expensive, and the device itself becomes larger

Method used

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Embodiment approach

[0037] based on Figure 1 to Figure 3 The cutting device according to the embodiment will be described. figure 1 It is a perspective view showing a configuration example of the cutting device according to the embodiment. figure 2 It is a perspective view of main parts showing a configuration example of the cutting device according to the embodiment. image 3 (a) is a cross-sectional view showing a state where the chuck table holding the divided chips of the cutting device according to the embodiment is positioned in the loading and unloading area. image 3 (b) is to show that the image 3 (a) is a cross-sectional view of a state where the chuck table moves from the loading and unloading area to the processing area. image 3 (c) is to show that all chips are from image 3 (b) is a cross-sectional view of the state where the chuck table is blown. image 3 (d) is to show that the image 3 (c) is a cross-sectional view of the state where the chuck table is positioned in the...

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PUM

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Abstract

The invention provides a cutting device. The cutting device can achieve low cost of the device self and can inhibit large-scale. The cutting device (1) comprises a clamping disc working table (10) attracting and holding an object to be processed (W) through a holding surface (11a), processing members (20a, 20b) for cutting processing of object to be processed (W) by utilization of a cutting knife (21), an X-axis moving member (30) moving the object to be processed (W) between a move-in and move-out region (O) and a processing region (P), and a chip moving member (60) blowing a fluid body to a chip (T) on the clamping disc working table (10) to move the chip (T) into a chip box (100). The chip moving member (60) comprises a chip blowing nozzle (61). The chip blowing nozzle sprays a fluid body (F) towards the chip on the holding surface to blow the chip towards the chip box. The chip box is adjacent to the end part of the X-axis moving member (30) and can be dismounted, and the chip box has an opening in a position lower than the holding surface of the clamping disc working table.

Description

technical field [0001] The present invention relates to cutting devices. Background technique [0002] In semiconductor device manufacturing processes and various electronic component manufacturing processes, a cutting device called a dicing machine is indispensable. It rotates an extremely thin cutting blade at high speed to divide the workpiece into individual products or chips. In this cutting device, a cutting tool with a blade thickness of 20 to 300 μm consisting of a bonding material and a large amount of fine abrasive grains (diamond or SiC (silicon carbide), etc.) contained in the bonding material is rotated at high speed. , crushes and removes the planned dividing line of the workpiece (semiconductor wafer or glass, resin substrate such as CSP or BGA, ceramics, etc.) at the micron level, and divides it into individual products or chips. [0003] Some workpieces will not have any problems even if the processed device chips are rough. For example, resin substrates s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50
CPCB28D5/0082B28D5/022H01L21/6779H01L21/67092H01L21/67721H01L21/687
Inventor 福冈武臣
Owner DISCO CORP