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Rigid and flexible circuit board and manufacturing method thereof

A printed circuit board, rigid-flexible technology, applied in the field of rigid-flexible printed circuit boards and its manufacturing, can solve problems such as excessive lamination load and increased production preparation time

Inactive Publication Date: 2014-12-24
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012]However, the conventional RFPCB is formed by repeating the process of applying a cover layer and laminating an insulating layer after forming a circuit pattern on both surfaces of a flexible copper clad laminate and Manufactured by the process of laminating a single-sided flexible copper-clad laminate with copper foil on one surface thereof and forming a circuit pattern, but due to repetition of the lamination process and circuit pattern forming process, an excessive lamination load occurs and increases Reduced production lead time (lead time) and manufacturing costs

Method used

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  • Rigid and flexible circuit board and manufacturing method thereof
  • Rigid and flexible circuit board and manufacturing method thereof
  • Rigid and flexible circuit board and manufacturing method thereof

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Embodiment Construction

[0036] Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings. The following embodiments merely illustrate the present invention, and the present invention is not limited to the following embodiments.

[0037] In describing the present invention, specific descriptions of well-known techniques are omitted so as not to unnecessarily obscure the embodiments of the invention. The following terms are defined in consideration of the functions of the present invention, and may be changed according to user's or operator's intention or custom. Therefore, these terms should be defined based on the contents described throughout this specification.

[0038] The technical spirit of the present invention should be defined by the appended claims, and the following embodiments are provided by way of examples to effectively convey the technical spirit of the present invention to those skilled in the art.

[0039] figure 1 wit...

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Abstract

The invention relates to a rigid and flexible circuit board and a manufacturing method thereof. The circuit board is formed through lamination of at least two or more bottom substrates with circuit layers on two surfaces. The rigid and flexible circuit board comprises a rigid region where rigid insulation layers are laminated on two surfaces of the bottom substrate respectively and a flexible region where coating layers are laminated on the sections where insulation layers are not laminated on two surfaces of the bottom substrate respectively. Surface roughness is formed on one surface of the coating layers laminated to contact each other in the coating layers.

Description

[0001] Cross References to Related Applications [0002] Claim and combine the following domestic priority applications and foreign priority applications by way of reference: [0003] "Cross References to Related Applications [0004] This application claims the benefit of Korean Patent Application No. 10-2013-0071604 filed on June 21, 2013, the entire contents of which are hereby incorporated by reference into this application. " technical field [0005] The present invention relates to a rigid flexible printed circuit board and a manufacturing method thereof, and more particularly, to a rigid flexible printed circuit board in which a base substrate is laminated in multiple layers and a manufacturing method thereof. Background technique [0006] In general, a printed circuit board (PCB) is a circuit board that serves to electrically connect or mechanically fix predetermined electronic components and includes an insulating layer made of an insulating material such as pheno...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/46
CPCH05K3/281H05K3/4644H05K3/4691
Inventor 姜惠贤孙相赫李亮制裵晙植
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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