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Manufacturing method of component built-in wiring board and semiconductor device

A technology of a wiring substrate and a manufacturing method, which is applied in the manufacture of printed circuit precursors, printed circuit manufacturing, printed circuit components, etc., can solve the problems of limited installation quantity, difficulty in meeting the requirements of high functionality and miniaturization, etc.

Active Publication Date: 2018-05-29
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, such components were only mounted on the surface circuit of the printed wiring board. However, the amount of mounting is limited, and it is difficult to meet the requirements of further higher functionality and miniaturization of printed wiring boards in recent years.

Method used

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  • Manufacturing method of component built-in wiring board and semiconductor device
  • Manufacturing method of component built-in wiring board and semiconductor device
  • Manufacturing method of component built-in wiring board and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0183]

[0184] In the method of the first embodiment of the present invention, a circuit board is used as the inner layer board. Therefore, the method of the first embodiment of the present invention includes the following steps (A1), (B1), (C1) and (D1) in order:

[0185] (A1) A step of vacuum-laminating a first adhesive film on a circuit board having the first thermosetting resin composition layer and the first main surface of the circuit board, wherein the circuit board has the first and The second main surface is formed with a cavity penetrating between the first and second main surfaces, and the first adhesive film includes a first support and a first thermosetting resin composition bonded to the first support. layer;

[0186] (B1) A step of temporarily assembling the component in the first thermosetting resin composition layer in the cavity;

[0187] (C1) The process of vacuum-laminating the second adhesive film on the second main surface of the circuit board in suc...

no. 2 Embodiment approach

[0260]

[0261] In the method of the second embodiment of the present invention, an insulating substrate is used as the inner layer substrate.

[0262] As mentioned above, when manufacturing a wiring board with built-in components, a circuit board is generally used as an inner layer board. In an embodiment in which a circuit board is used as an inner layer board, in general, components are placed inside the circuit board, and then an insulating layer and a conductor layer are sequentially laminated to obtain a component-built-in wiring board with multilayer wiring. . In this regard, depending on electronic equipment, a wiring board (two-layer wiring board) in which circuits are formed on both surfaces of an insulating substrate may be used. The inventors of the present invention conceived that, in such a case, components are arranged inside an insulating substrate, and then an insulating layer and a conductor layer are formed to obtain a two-layer wiring substrate with high...

Embodiment 1-1

[0394] Using the first adhesive film 1 and the second adhesive film 1 , the substrates a1 to d1 were produced in accordance with the above-described procedure of [Preparation 1 of the sample for measurement and evaluation]. Each evaluation result is shown in 2-1. In addition, regarding the obtained substrate b1, the height of the non-resin-filled region of the cavity (h B ) is 97 μm.

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PUM

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Abstract

The subject of the present invention is to provide a manufacturing method of a substrate having elements wiring therein. This method is capable of restraining the substrate from curving and restraining the arrangement of elements inside hollow holes from variation, and thereby achieves the excellent precision of the element arrangement. The solution means of the present invention is to provide a manufacturing method of a substrate having elements wiring therein, comprising the following steps (A), (B), (C) and (D) in order: (A) at an inner layer substrate having a first and a second main face and hollow hole which is formed to pass therebetween, executing a vacuum lamination step on a first adhesive film including a first sustaining body and a first thermal curing resin composition layer connected with the first sustaining body in the manner of the first thermal curing resin composition layer joining the first main face of the inner layer substrate; (B) executing a step of temporarily immobilizing components at the first thermal curing resin composition layer inside the hollow hole; (C) at the second main face of the inner layer substrate, executing a vacuum lamination step with a second adhesive film including a second sustaining body and a second thermal curing resin composition layer connected with the second sustaining body in the manner of the second thermal curing resin composition layer joining the second main face of the inner layer substrate, and executing this vacuum lamination step under a condition that the heating temperature at the surface of the first adhesive film is lower than the heating temperature at the surface of the second adhesive film; and (D) executing a step of forming an insulation layer by thermally curing the first and second thermal curing resin composition layers.

Description

technical field [0001] The present invention relates to a method of manufacturing a component-embedded wiring board and a semiconductor device. Background technique [0002] In recent years, demand for small, high-performance electronic devices such as smartphones and tablet PCs has been increasing. Along with this, further higher functionality and miniaturization of printed wiring boards used in such small high-function electronic devices are required. [0003] Components such as a bare chip, a chip capacitor, and a chip inductor are mounted on the printed wiring board. Conventionally, such components have been mounted only on the surface circuits of printed wiring boards. However, the number of mounted components is limited, and it is difficult to meet the demands for higher functionality and miniaturization of printed wiring boards in recent years. [0004] In order to cope with such a problem, a component-embedded wiring board has been proposed as a printed wiring boar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/30H05K1/18H05K1/11
CPCH05K1/0271H05K1/185H05K3/022H05K3/4697H05K2201/068
Inventor 奈良桥弘久中村茂雄真子玄迅
Owner AJINOMOTO CO INC