Automatic testing equipment and method for l3-layer circuit board

Abstract

The invention discloses an automatic testing device and method for L3 layer circuit boards, and relates to the field of function and performance testing of circuit boards of communication equipment. The equipment includes a test subrack, a network management platform and integrated instruments; the test subrack is equipped with an automatic test unit, which includes a power supply module, a clock module, a field programmable gate array FPGA module, a single disk management control module, and an Ethernet switching module and interface circuit module; the clock module, FPGA module, interface circuit module, single-disk management control module, and Ethernet switching module are all connected to the power module; the clock module, interface circuit module, single-disk management The FPGA module is connected; the single disk management control module is connected with the Ethernet switching module. The invention not only has high test accuracy and test efficiency, but also occupies less test environment resources, can reduce the construction cost, shorten the construction process, and is convenient for people to use.

Description

technical field [0001] The invention relates to the field of function and performance testing of circuit boards of communication equipment, in particular to an automatic testing device and method for L3 layer circuit boards. Background technique [0002] IPRAN (IP Radio Access Network Carrier, IP-based wireless backhaul bearer network) communication equipment is mainly used in the metropolitan area network. When IPRAN communication equipment is used, it is mainly based on base station backhaul, which can meet the routing solution of integrated service bearer. The core of IPRAN communication equipment is the L3 (network layer) layer circuit board. With the continuous development of optical communication, the L3 layer circuit board has been widely used in society. The test method used for production test and verification test of L3 layer line disk is: testers use IPRAN functional subrack to build a complex point-to-point test platform, import cross-connection configuration in ...

AI Technical Summary

Problems solved by technology

The functional subrack is not only larger in size and power consumption, but also heavy in weight and occupies a large space, which in turn takes up a lot of test environment resources. When building a test platform (especially when building multiple sets of test platforms), it improves the test platform. The cost of construction prolongs the construction process of the test platform; it is not convenient for people to use for building multiple sets of test platforms

[0005] (2) The functional test items for the verification test and production test of the L3 layer line disk are: business connection test, clock function test, L3 layer static service test, LSP (Label Switched Path, label switching path) 1:1, Bfd (Bidirectional Forwardding Detection, bidirectional forwarding detection), OAM (Operation Administration and Maintenance, operation, management and maintenance), MCC (Management Communication Channel, management communication channel), S1 (synchronization status flag) and clock extraction, there are many functional test items, When testing all functional test items, it is necessary to manually unplug and insert optical fibers, switch between the main and standby SCUO1 disks, and manually control the instrument to send and receive packets. The operation process is relatively complicated.

[0006] (3) The optical fiber connection of the existing test platform is relatively complicated, and the test time of a single machine disk is about 15 minutes, and the test efficiency is low

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