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Method for preparing unified-size and uniformly-dispersed PI/SiO2 nanocomposite film in novel coupling way

A nano-composite and evenly dispersed technology, applied in the field of preparing PI/SiO2 nano-composite films, can solve the problem of uneven distribution of nanoparticles, and achieve the effects of high mechanical strength, small particle size and high dispersibility

Inactive Publication Date: 2015-01-07
HARBIN UNIV OF SCI & TECH
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  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention is to solve existing PI / SiO 2 During the preparation of nanocomposite films, there are problems of uneven distribution and agglomeration of nanoparticles in the polyimide matrix, and a new coupling method is provided to prepare PI / SiO with uniform size and uniform dispersion 2 Nanocomposite film method

Method used

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  • Method for preparing unified-size and uniformly-dispersed PI/SiO2 nanocomposite film in novel coupling way
  • Method for preparing unified-size and uniformly-dispersed PI/SiO2 nanocomposite film in novel coupling way
  • Method for preparing unified-size and uniformly-dispersed PI/SiO2 nanocomposite film in novel coupling way

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specific Embodiment approach 1

[0020] Specific implementation mode 1: A new coupling method described in this implementation mode prepares PI / SiO with uniform size and uniform dispersion 2 The method of nanocomposite film is to carry out as follows:

[0021] 1. Dissolve the monomeric diamine in N,N-dimethylacetamide, stir mechanically until the monomeric diamine is completely dissolved; then add dianhydride to the mixture, stir mechanically until the dianhydride is completely dissolved, and continue stirring for 2 hours ~4h, obtain polyamic acid solution; The mass of described monomeric diamine and the volume ratio of N,N-dimethylacetamide are 1g:(15~20) mL; The monomeric diamine and dianhydride The mass ratio is 1:1; the adding method of the dianhydride is as follows: add the dianhydride in 5 times on average;

[0022] 2. Add coupling agent to the polyamic acid solution obtained in step 1, add silicon source to it after stirring for 0.5h~2h, and let it stand for 12h~18h to obtain polyamic acid mixed solut...

specific Embodiment approach 2

[0026] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the volume ratio of the mass of monomeric diamine in step 1 to N,N-dimethylacetamide is 1g:18mL. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0027] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the mass ratio of monomer diamine to dianhydride in step 1 is 1:1. Others are the same as in the first or second embodiment.

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Abstract

The invention discloses a method for preparing a unified-size and uniformly-dispersed PI / SiO2 nanocomposite film in a novel coupling way, relating to a method for preparing a PI / SiO2 nanocomposite film and aiming to solve the problems of non-uniform distribution and aggregation of nanoparticles in a polyimide matrix in the existing PI / SiO2 nanocomposite film preparation process. The method comprises the steps of adding a coupling agent into a system on the basis of the traditional sol-gel polymerization method, and connecting SiO2 and a PI matrix together in a novel coupling way to prepare the unified-size and uniformly-dispersed PI / SiO2 nanocomposite film serving as a novel industrial material. The method is used for preparing the PI / SiO2 nanocomposite film.

Description

technical field [0001] The invention relates to a method for preparing PI / SiO 2 Nanocomposite film method. Background technique [0002] In the past 30 years, the rapid development of science and technology, especially the rapid development of cutting-edge science and technology, has made people's requirements for material properties higher and higher. In many aspects, traditional single materials can no longer meet actual needs. This prompts people to study the preparation and properties of composite materials. [0003] In general, polymer / inorganic nanocomposites have many advantages over conventional inorganic / polymer composites. Since the interface between the inorganic nanofiller and the polymer is not macroscopic, but microscopic, even at the molecular level, the interface area is large, which can greatly reduce the interface stress concentration and eliminate the difference in thermal expansion coefficient between the inorganic substance and the polymer matrix. The...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08K3/36C08G73/10
Inventor 林家齐杨文龙熊燕玲刘莹沈涛代丽刘刚迟庆国
Owner HARBIN UNIV OF SCI & TECH
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