Formula of acid-based colloidal palladium activation solution

Abstract

The invention discloses a formula of an acid-based colloidal palladium activation solution. The formula of the acid-based colloidal palladium activation solution comprises the following components in weight mixture ratios: a solution A containing 1g / L of palladium oxide, 165ml / L of oxalic acid, 2.68g / L of ferrous chloride and 200mL / L of deionized water; a solution B containing 75g / L of ferrous chloride, 8.5g / L of sodium ferrate and 110mL / L of oxalic acid. The invention provides the formula of the acid-based colloidal palladium activation solution, which has the advantages of strong activation performance and environmental friendliness.

Description

technical field [0001] The invention relates to a formula of an activation solution in an electroless copper plating process. Background technique [0002] In the electroless copper plating process, the activation solution forms colloidal particles containing metal palladium in the solution. During the activation treatment, physical adsorption is used to form a palladium activation center on the surface of the substrate. Therefore, the precious metal in the activation solution will not form between the metal copper After replacing the metal layer, only a monomolecular layer of catalytic particles is produced on the surface of the substrate after activation, which provides a good surface state for improving the bonding force of the coating. The existing acid-based colloidal palladium activation solution is a colloidal palladium activation solution with a high-concentration hydrochloric acid aqueous solution as the dispersion medium. Because the activation solution contains hy...

AI Technical Summary

Problems solved by technology

The existing acid-based colloidal palladium activation solution is a colloidal palladium activation solution with a high-concentration hydrochloric acid aqueous solution as the dispersion medium. Because the activation solution contains hydrochloric acid with a high concentration, the activity of hydrochloric acid is very strong, and it is an acid with strong penetrating ability. , the technology erodes the oxide layer around the hole of the multilayer board and the copper foil of the inner layer connection plate, resulting in a "pink circle". The acid-based colloidal palladium activation solution contains a thick colloidal stannate compound, which is not conducive to improving the colloidal The activation performance of palladium is also detrimental to the bonding force between the electroless copper layer and the substrate copper foil, and the amount of hydrochloric acid in the acid-based colloidal palladium activation solution is large, the acid mist is large, and the working environment is poor, which is not conducive to the health of operators and endangers the environment.