Nail embedded floor heating floor

A floor and floor heating technology, applied in the field of studded floor heating, can solve problems such as environmental protection, poor human contact feeling and aesthetics, and floor warping and deformation.

Inactive Publication Date: 2015-01-07
NANJING VOCATIONAL UNIV OF IND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the floor heating technology uses heating from the lower floor, the floor bears a large temperature difference. If ordinary solid wood flooring is used to pave the ground, the floor is prone to warping and deformation. Therefore, it is generally made of non-solid wood materials (such as heat-conducting plastics or inorganic materials). And this material is obviously not as good as solid wood flooring in terms of environmental protection, human body contact feeling and aesthetics.

Method used

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  • Nail embedded floor heating floor
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Experimental program
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Embodiment Construction

[0015] The floor heating floor with studs of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0016] Such as figure 1 , 2 As shown, a floor heating floor with studs includes a body 1 and metal heat-conducting nails 2; a group of metal heat-conducting nails are evenly inlaid on the body and run through the entire body from top to bottom. From top to bottom, the main body is the floor surface layer 3, the floor core layer 4, and the floor substrate 5; the floor surface layer, the floor core layer and the floor substrate are made of solid wood or plastic. The floor surface and the floor substrate are respectively glued to the upper surface and the lower surface of the floor core.

[0017] Metal heat conducting nails can be made of aluminum, copper, stainless steel, various alloys and other materials with good thermal conductivity. Circular, elliptical, polygonal or arbitrary shapes can be used.

[0018] The upper end...

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PUM

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Abstract

The invention discloses a nail embedded floor heating floor. The nail embedded floor heating floor comprises a body and a metal heat conduction nail; the metal heat conduction nail is embedded in the body and penetrates the body; the body comprises a floor surface layer, a floor core layer and a floor substrate from top to bottom in turn; the floor surface layer, the floor core layer and the floor substrate can be formed by solid wood or plastic materials. The heat of a floor lower layer can be rapidly transmitted above the floor through the metal heat conduction nail and accordingly the temperature of the upper side and the lower side of the solid wood floor can be rapidly balanced and accordingly the floor deformation and warp caused by the too large upper and lower temperature difference of the floor is avoided. The nail embedded floor heating floor can be combined with the traditional manufacturing process of solid wood floors, the heat conduction is good, the warp and the deformation are not easy to cause, the cleaning is easy, and the attractive and environment-friendly effect is achieved.

Description

technical field [0001] The invention relates to a building interior decoration material, in particular to a floor heating floor with studs. Background technique [0002] In the field of architectural interior decoration, floor heating technology is widely used, and various solid wood floors have also been widely used. [0003] Underfloor heating technology uses heating from the lower floor. This heat conduction method can make the vertical distribution of indoor temperature form a state of high and low (approximately below 0.5m), which can make the occupants feel hot enough and cool at the head. People's comfort, improving work efficiency, energy saving and environmental protection are all beneficial. Since the floor heating technology uses heating from the lower floor, the floor bears a large temperature difference. If ordinary solid wood flooring is used to pave the ground, the floor is prone to warping and deformation. Therefore, it is generally made of non-solid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/04F24D13/02
Inventor 范翔白顺科张俊
Owner NANJING VOCATIONAL UNIV OF IND TECH
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