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A flux and solder paste

A technology of flux and solder paste, used in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of increasing material and time costs, and achieve good coating and curing effects, sufficient curing, and coating. uniform effect

Active Publication Date: 2017-01-18
SHANGHAI SANSI ELECTRONICS ENG +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods will undoubtedly significantly increase material and time costs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0028] Prepare the fluxes of Examples 1-5 and Comparative Examples 1-4 according to the compositions shown in the following Tables 1, 2, 3, and 4 respectively, and use the fluxes of Examples and Comparative Examples to prepare solder pastes to compare the addition of polylactic acid The relationship between the presence or absence of solder powder and the prevention of solder powder sedimentation and the effect of adding polylactic acid on wettability. In addition, the relationship between the amount of polylactic acid added and the residue remaining, the relationship between the content of ethyl acetate and the wettability of solder paste, and the effects of polylactic acid and PMMA (polymethyl methacrylate) as solder paste additives on the prevention of solder powder sedimentation properties and wetting properties were compared.

[0029] Experiment 1: Comparing the relationship between the addition of polylactic acid and the prevention of solder powder settlement and the eff...

Embodiment 1

[0041] Example 1: No sedimentation of solder powder was observed.

Embodiment 2

[0061] Example 2: No sedimentation of the solder powder was found.

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Abstract

The invention discloses a soldering flux and soldering paste. The soldering flux is used for being mixed with solder powder to generate the soldering paste, the soldering flux comprises polylactic acid, and the addition amount of the polylactic acid meets the condition that the solder powder in the soldering paste does not settle in a normal temperature environment. The weight percentage of the polylactic acid in the soldering flux is larger than or equal to 0.1% and smaller than 2.0%. The soldering flux containing the polylactic acid in the content has the function of preventing the solder powder from settling in the normal temperature environment, the soldering flux can be decomposed and evaporated due to heating in the welding process and no solder residues are left. Besides, the soldering flux contains a cosolvent with good solubleness for the polylactic acid, the cosolvent is preferably ethyl acetate, dispersion of the polylactic acid is facilitated, and influences of the polylactic acid on wettability of the soldering paste are reduced.

Description

technical field [0001] The invention relates to a flux and a solder paste, in particular to a flux and a solder paste capable of preventing solder powder from settling and realizing no residue. Background technique [0002] Flux has the function of removing the metal oxide existing on the metal surface of the solder and the soldering object when the solder is melted, and making it possible to move the metal elements at the interface between the two. Flux can form an intermetallic compound between the solder and the metal surface of the soldering object, so that a strong bond can be obtained. [0003] Solder paste is a composite material made by mixing solder powder and flux. The flux components used in solder paste mainly include: activators that improve wettability and activity, solvents that can dissolve various parts (mainly solid parts), rosin that can remove oxide films, and can prevent solder powder from settling , and a thixotropic agent that can adjust the viscosit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/362
CPCB23K35/3612B23K35/362
Inventor 许礼何孝亮李应启唐德
Owner SHANGHAI SANSI ELECTRONICS ENG
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