Method for cutting base plate by laser and laser cutting equipment

A laser cutting and substrate technology, applied in the field of laser cutting substrates and laser cutting equipment, can solve problems such as single cutting path, inability to correspond to special-shaped cutting, and fixed cutting sequence

Inactive Publication Date: 2015-01-28
HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD +1
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

Among them, the cutting path of cutter wheel cutting and CO2 laser cutting is single, including only horizontal and vertical straight cutting pat

Method used

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  • Method for cutting base plate by laser and laser cutting equipment
  • Method for cutting base plate by laser and laser cutting equipment
  • Method for cutting base plate by laser and laser cutting equipment

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Embodiment Construction

[0034] In order to increase the stress failure force point during substrate cutting, improve the effect of substrate cutting, and reduce the situation of substrate cracking. The embodiment of the present invention provides a laser cutting substrate method and laser cutting equipment. In the technical solution of the embodiment of the present invention, by adding an auxiliary splitting line, the effect of cutting out the irregular shape when laser cutting the substrate is improved, and the effect of substrate cutting is improved. , to improve the cracking of the substrate. In order to make the object, technical solution and advantages of the present invention clearer, the following non-limiting examples are taken as examples to further describe the present invention in detail.

[0035] The invention provides a method for laser cutting a substrate, the method comprising the following steps:

[0036] On the substrate, a plurality of first parallel lines along a first direction, ...

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Abstract

The invention relates to the technical field of production of display devices and discloses a method for cutting a base plate by laser and laser cutting equipment. The method comprises the following steps: a plurality of crossed first parallel lines and second parallel lines are engraved on the base plate, an area engraved with a subbase plate shape is defined by the first parallel lines and the second parallel lines, and an outline is positioned in the area with the subbase plate shape; an auxiliary splitting line is engraved outside the outline in the area engraved with the subbase plate shape; and the minimum distance from the end part of the auxiliary splitting line, facing the outline line, to the outline line is within a first set threshold. The parallel lines and the auxiliary splitting line are set to help split the base plate, the stress damage points of the base plate during cutting are increased, a phenomenon that the glass base plate is broken when being cut is avoided and the finished product rate of base plate cutting is effectively improved; and besides, the cutting path is designed reasonably and skillfully, the cut base plate can be completely separated and an automatic taking-out condition can be achieved.

Description

technical field [0001] The invention relates to the technical field of display device production, in particular to a laser cutting substrate method and laser cutting equipment. Background technique [0002] The existing glass cutting equipment is mainly divided into cutter wheel cutting and CO2 laser cutting. The cutter wheel splitting methods mainly include natural splitting, steam type, hot air type and pressure type. The splitting method of CO2 laser cutting is mainly thermal shock. Among them, the cutting path of wheel cutting and CO2 laser cutting is single, including only horizontal and vertical straight cutting paths, and can only cut substrates with relatively simple shapes, which cannot be used for special-shaped cutting, and the cutting sequence is fixed. Contents of the invention [0003] The invention provides a laser cutting substrate method and laser cutting equipment, which are used to increase the stress damage point during substrate cutting, improve the cu...

Claims

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Application Information

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IPC IPC(8): C03B33/08
CPCC03B33/0222C03B33/04C03B33/037B23K26/0006B23K26/359B23K2103/50B23K2103/54B23K26/364B23K26/402C03B33/082
Inventor 陶胜黄阳董岱褚兵兵
Owner HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD
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