Automatic feeding device of horizontal diffusion furnace

Abstract

The invention discloses an automatic feeding device of a horizontal diffusion furnace. A cantilever can be controlled to descend by a lifting mechanism, and after the cantilever and a wafer boat loaded on the cantilever are horizontally fed into a furnace tube of the diffusion furnace by a push-pull boat, the wafer boat can be discharged on a support platform in the furnace tube, so that the cantilever can be drawn out of the furnace tube, and only the wafer boat is separately subjected to a diffusion process, therefore, the quality and production efficiency of the diffusion process are improved, and the application and maintenance costs can be saved.

Description

technical field [0001] The invention relates to an automatic feeding system for semiconductor equipment, more specifically, to an automatic feeding device for a horizontal diffusion furnace using a cantilevered push-pull boat. Background technique [0002] At present, the main process form of the horizontal diffusion furnace used in the semiconductor and solar energy industries is the "cantilever diffusion" process. see Figure 1 ~ Figure 2 , Figure 1 ~ Figure 2 It is a schematic diagram of the working state of the automatic feeding system of an existing horizontal diffusion furnace. like figure 1 As shown, the existing horizontal diffusion furnace uses a cantilevered push-pull boat for automatic feeding, and its automatic feeding system is horizontally arranged outside the feeding window 23 of the furnace tube 24 of the horizontal diffusion furnace, mainly including a push-pull boat for feeding 7. The front end of the push-pull boat 7 is provided with a horizontal canti...

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Problems solved by technology

[0004] 1. The cantilever blocks the heat energy from the bottom of the furnace tube, forming a "shadow effect" on the silicon wafer in the wafer boat it carries, which will have a certain adverse effect on the uniformity of the process;

[0005] 2. During the process, the process gas will be deposited on the cantilever. When the cantilever is in the process of feeding and discharging materials, it is easy to produce by-products such as particles, which will affect the reduction of particle indicators, and will cause secondary pollution to the purification work area, making cleaning The cycle is shortened and the cleaning workload is increased;

[0007] 4. Since the process gas will be deposited on the cantilever, the injection volume of the process gas is increased and the loss is increased

[0008] With the increase of silicon wafer diffusion resistance, the continuous improvement of its diffusion uniformity requirements, and the increasingly serious secondary pollution of silicon wafers by process by-products, the above-mentioned existing cantilever diffusion methods can no longer meet the requirements of the semiconductor and solar energy industries. development requirements

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