LDMOS (Laterally Diffused Metal Oxide Semiconductor) device with shielding ring and preparation method thereof
A shielding ring and device technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as failure to optimize the breakdown voltage of radio frequency devices, and achieve the effect of changing the breakdown voltage and optimizing performance
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Embodiment 1
[0041] Such as figure 2 Shown is the schematic diagram of the structure of the LDMOS device obtained through the simulation of the ISE TCAD process provided by the embodiment of the present invention. The structure diagram of the LDMOS device is as follows image 3 As shown, for ease of description, only the parts related to the embodiment of the present invention are shown, including:
[0042] Resistivity 0.05~0.15Ω / cm 3 P+ silicon substrate.
[0043] In an embodiment of the present invention, a radio frequency LDMOS (Lateral Double-diffused MOS, referred to as: lateral double-diffused field effect transistor) device is fabricated on a P+ silicon substrate, and the radio frequency LDMOS device first includes: a resistivity of 0.05 to 0.15Ω / cm 3 P+ silicon substrate.
[0044] Epitaxially formed on the P+ silicon substrate with a thickness of 9 μm and a doping concentration of 6*10 14 cm -3 ~8*10 14 cm -3 The P-type epitaxial region.
[0045] In the embodiment of the...
Embodiment 2
[0090] A flowchart of a method for preparing a light-shielding device provided in an embodiment of the present invention, the method includes the following steps:
[0091] The resistivity of the preparation is 0.05~0.15Ω / cm 3 P+ silicon substrate;
[0092] Formed by epitaxy on the P+ silicon substrate with a thickness of 9 μm and a doping concentration of 6*10 14 cm -3 ~8*10 14 cm -3 The P-type epitaxial region;
[0093] The B impurity implantation dose of the P well formed in the P-type epitaxial region is 2*10 13 cm -2 ~4*10 13 cm -2, The channel area with energy of 40-60Kev and high-temperature propulsion time of 40-60min at 1000-1100°C;
[0094] forming a source region with a field oxygen thickness of 1.8-2.2 μm through the N+ doped region formed in the P well;
[0095] The As impurity implantation dose formed in the N-doped region in the P-type epitaxial region is 1.1*10 12 cm -2 ~1.5*10 12 cm -2 . A drift region with an energy of 140-160Kev, a high-temperat...
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Abstract
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