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Copper foil for circuit board and circuit board

A circuit board, copper foil technology, applied in printed circuit parts, chemical instruments and methods, layered products, etc., can solve the problem of low visibility of resin films, achieve non-destructive visibility and ensure tightness. Effect

Active Publication Date: 2018-11-13
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this invention, the surface of the copper foil is roughened in order to improve the adhesion to the battery electrode mixture, so the visibility of the resin film for wiring boards after transferring the surface of the foil is low

Method used

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  • Copper foil for circuit board and circuit board
  • Copper foil for circuit board and circuit board
  • Copper foil for circuit board and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0117] Hereinafter, the present invention will be described based on examples, but these examples are illustrative and the present invention is not limited thereto.

[0118] An electrolytic copper foil having a M surface glossiness of 230% and an S surface glossiness of 100% was used. After the electrolytic copper foil was degreased and pickled, roughening treatment, PR pulse electrolysis, and alkali immersion treatment were performed under the conditions shown in Table 1 below.

[0119] Table 1

[0120]

[0121]

[0122] ※Alkali impregnation treatment solution: NaOH / L

[0123] Coarsening treatment liquid additive PPS: propane sulfonate pyridinium salt

[0124] ton: Pulse Shun electrolysis time

[0125] trev: pulse reverse electrolysis time

[0126] toff: pulse electrolysis stop time

[0127] Ion: pulse forward current density

[0128] Irev: pulse reverse current density

[0129] The produced electrodeposited copper foils of each example and each comparative examp...

no. 2 Embodiment approach

[0162] As mentioned above, the electrolytic copper foil was demonstrated as 1st Embodiment of the copper foil of this invention, However, The surface treatment of the rolled copper foil is the same as the copper foil of 2nd Embodiment.

[0163] That is, the same surface treatment as the surface treatment performed on the M surface or the S surface of the electrodeposited copper foil of the first embodiment is performed on any one of the rolled surfaces of the rolled copper foil of the second embodiment.

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Abstract

The invention provides an electrolytic copper foil for a circuit board which is suitable for circuit boards, and a resin can be pasted on the electrolytic copper foil tightly, and circuit patterns are visual after the circuit patterns are formed. In the electrolytic copper foil for the circuit board, the diffuse reflectance (Rd) of the surface of one side of the bonded surface of the bonding resin of the electrolytic copper foil is 5-50% under the condition that the wave length is 600nm, and the saturation (C*) is smaller than 50. In the electrolytic copper foil for the circuit board, preferably, the brightness index (L*) is set to be smaller than 75, more preferably, the total reflectivity (Rt) is set to be 10-55% under the condition that the wave length is 600nm.

Description

technical field [0001] The present invention relates to a copper foil used for wiring boards, and more specifically, to a copper foil suitable for wiring boards having both resin adhesion and visibility of resin permeation after circuit pattern formation. Background technique [0002] Wiring boards are used as substrates and connection materials in various types of electronic equipment, and copper foil is generally used in the conductive layer of wiring boards. [0003] The copper foil used in the above circuit boards is usually provided in the form of rolled copper foil or electrolytic copper foil. [0004] Rolled copper foil used in copper foil for wiring boards contains additives such as metals as essential components in order to suppress crystal growth due to accumulated heat generated during the manufacturing process. Therefore, the original conductivity of the copper foil may be reduced, and the manufacturing cost is also higher than that of the electrolytic copper fo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/09B32B15/08C25D5/54
CPCC25D3/38H05K1/02
Inventor 筱崎淳斋藤贵广
Owner FURUKAWA ELECTRIC CO LTD