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Evaporation device for double e-type electron gun and method for vapor deposition using the device

An electron gun and evaporation technology, which is applied in the field of electronic evaporation, can solve the problems of increasing coating time, complicated process, and increasing cost, and achieve the effect of improving adhesion, simple equipment, and high adhesion

Inactive Publication Date: 2016-12-07
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the ways to improve the adhesion between the film layer and the substrate mainly include annealing, using adhesives, adding transition layers, etc., among which annealing increases the production time and the complexity of the process; the use of adhesives will increase the cost and shorten the curing time. Prolonged, the migration of the film layer is prone to occur; adding a transition layer will increase the coating time and production cost, making the process complicated

Method used

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  • Evaporation device for double e-type electron gun and method for vapor deposition using the device

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Embodiment 1

[0021] Such as figure 1 As shown, an evaporation device for double e electron guns includes an evaporation chamber. Two double e electron guns are arranged in the evaporation chamber. The e type electron gun I1 is arranged on the top of the evaporation chamber for heating. The substrate 5 on the top of the evaporation chamber is fixed to the top of the evaporation chamber by a bracket 4. The e-type electron gun II3 is arranged at the bottom of the evaporation chamber, and its position is opposite to the e-type electron gun I1, and is used to bombard the coating material 7, which is high-purity gold. The device includes a crucible 8 for holding the coating material 7, and the crucible 8 is located at the bottom of the evaporation chamber and is arranged opposite to the substrate 5. The vapor deposition device also includes a vacuum pump group 6 for evacuating the vapor deposition chamber.

[0022] The method for vapor deposition using the above device includes the following proc...

Embodiment 2

[0027] Such as figure 1 As shown, an evaporation device for double e electron guns includes an evaporation chamber. Two double e electron guns are arranged in the evaporation chamber. The e type electron gun I1 is arranged on the top of the evaporation chamber for heating. The substrate 5 on the top of the evaporation chamber is fixed to the top of the evaporation chamber by a bracket 4. The e-type electron gun II3 is arranged at the bottom of the evaporation chamber, and its position is opposite to the e-type electron gun I1, and is used to bombard the coating material 7, which is high-purity titanium. The device includes a crucible 8 for holding the coating material 7, and the crucible 8 is located at the bottom of the evaporation chamber and is arranged opposite to the substrate 5. The vapor deposition device also includes a vacuum pump group 6 for evacuating the vapor deposition chamber.

[0028] The method for vapor deposition using the above device includes the following ...

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Abstract

The invention relates to an evaporation device with double-e type electron guns and an evaporating method by using the same, and belongs to the field of electronic evaporation. The device comprises an evaporation chamber, wherein two double-e type electron guns are arranged in the evaporation chamber; the e-type electron gun I is used for heating a substrate, and the e-type electron gun II is used for bombarding a film-coating material. The device is simple in equipment and operation, and is capable of improving the adhesive force between a film coating and the substrate, so that high adhesive force between a single film coating and the substrate can be realized, and multi-layer film coating for improving the adhesive force between the film coating and the substrate is not needed.

Description

Technical field [0001] The invention relates to a vapor deposition device of a double-e electron gun and a vapor deposition method using the device, and belongs to the field of electronic vapor deposition. Background technique [0002] Vacuum coating technology is a rapidly developing and widely used surface film forming technology. It can not only be used to prepare thin film coatings with various special properties (such as super hard, high corrosion resistance, heat resistance and oxidation resistance, etc.), but also It can be used to prepare various functional film materials and decorative film coatings. Vacuum evaporation coating is a kind of vacuum coating technology, in which the substrate or workpiece to be coated is placed in a high vacuum chamber, and the evaporation material is vaporized (or sublimated) by heating, leaving atoms, molecules or atomic groups on the surface of the melt and condensing on A process in which a substrate or workpiece surface with a certain ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/30
CPCC23C14/30
Inventor 谭毅李鹏廷姜大川王登科
Owner DALIAN UNIV OF TECH