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Light-reflective anisotropic conductive adhesive and light-emitting device

一种导电粘接剂、光反射性的技术，应用在导电粘合剂、胶粘剂、导电材料等方向，能够解决LED元件33发光效率降低等问题，达到波长依赖性小、提高发光效率、防止变色的效果

Active Publication Date: 2015-02-18
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But when image 3 In the case of the light-emitting device, among the light emitted by the LED element 33, the light with a wavelength of 400 to 500 nm emitted from the upper side is absorbed by the gold wire, and part of the light emitted from the lower side is absorbed by the die-bonding adhesive 32. Problem of Decreased Luminous Efficiency of LED Element 33

Method used

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  • Light-reflective anisotropic conductive adhesive and light-emitting device
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  • Light-reflective anisotropic conductive adhesive and light-emitting device

Examples

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preparation example Construction

[0073]

[0074] The light-reflective anisotropic conductive adhesive of the present invention can be prepared by uniformly mixing the above-described light-reflective insulating particles, conductive particles, and thermosetting resin composition according to a conventional method. In addition, in the case of making a light-reflective anisotropic conductive adhesive film, it is only necessary to disperse and mix them with a solvent such as toluene, and apply it on a peeled PET film so that it has a desired thickness, at about 80 It can be dried at a temperature of about ℃.

[0075]

[0076] In order to improve the luminous efficiency of the light-emitting element, with regard to the reflective properties of the light-reflective anisotropic conductive adhesive of the present invention, it is desired that the cured product of the light-reflective anisotropic conductive adhesive has a reflectance of light with a wavelength of 450 nm ( JIS K7105) at least 30%. In order to obt...

Embodiment 1

[0087] Embodiment 1, comparative example 1-3

[0088] A light-reflective anisotropic conductive adhesive was prepared by uniformly mixing the components of the blend composition shown in Table 1.

[0089] It should be noted that, in Example 1, the epoxy compound and the acid anhydride curing agent were blended so that the ratio of the number of epoxy groups / acid anhydride functional groups was 1 / 1.1. In addition, the anisotropic conductive adhesive of Comparative Example 2 was obtained by mixing light-reflective insulating particles and conductive particles into a two-component curing type dimethyl silicone resin (IVS4742, Momentive Performance Materials Inc.). The anisotropic conductive adhesive of 3 is obtained by mixing light-reflective insulating particles and conductive particles with a two-component curing type phenyl silicone resin (SCR-1012, Shin-Etsu Chemical Co., Ltd.).

[0090]

[0091] (evaluate)

[0092] The wafer shear strength of the obtained light-reflective...

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Abstract

Provided is a light-reflective anisotropic conductive adhesive for use for an anisotropic conductive connection between a light-emitting device and a circuit board, which comprises a thermosetting resin composition, conductive particles and light-reflective insulating particles. The thermosetting resin composition comprises diglycidyl isocyanuryl modified polysiloxane represented by formula (1) and a curing agent for an epoxy resin.

Description

technical field [0001] The present invention relates to a light-reflective anisotropic conductive adhesive used for anisotropically conductively connecting a light-emitting element to a wiring board, and a light-emitting device in which a light-emitting element is mounted on a wiring board using the adhesive. Background technique [0002] Light-emitting devices using light-emitting diode (LED) elements are widely used, such as image 3 As shown, the structure of the old-fashioned light-emitting device is as follows: the LED element 33 is bonded to the substrate 31 with a die bond adhesive 32, and the p-electrode 34 and n-electrode 35 on it are wired with gold wires 37. The connection terminals 36 of the substrate 31 are bonded (wire bonded), and the entire LED element 33 is sealed with a transparent molding resin 38 . But when image 3 In the case of the light-emitting device, among the light emitted by the LED element 33, the light with a wavelength of 400 to 500 nm emitted...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J9/02C09J11/04C09J11/06H01B1/00H01B1/22H01L33/62
CPCH05K2201/10106H01B1/22H01L2224/73204H01L2924/12041H01L33/46H05K3/323H01L2224/48227C08K2201/001H01L24/29H05K2201/2054C09J183/08H01L2924/07811C08G77/388H01L33/62H01L2224/16225H01L2224/48091H01L2224/73265C09J9/02H01L2224/32225H01L2224/45144H01L2924/181H01L2924/00014H01L2924/00C09J11/04C09J11/06C09J183/04C08K9/10
Inventor 森田惠介须永友康
Owner DEXERIALS CORP
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