Manufacturing method of flexible displaying substrate and flexible displaying substrate

A flexible display and manufacturing method technology, which is applied in the manufacturing of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems affecting the performance and display effect of flexible display substrates, so as to reduce the manufacturing cost, simplify the manufacturing process, and improve the yield. Effect

Active Publication Date: 2015-02-25
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the commonly used separation technology of flexible display substrate and carrier substrate is the method of laser lift-off.

Method used

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  • Manufacturing method of flexible displaying substrate and flexible displaying substrate
  • Manufacturing method of flexible displaying substrate and flexible displaying substrate
  • Manufacturing method of flexible displaying substrate and flexible displaying substrate

Examples

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[0041] In order to make the technical problems, technical solutions, and advantages to be solved by the embodiments of the present invention clearer, a detailed description will be given below with reference to the drawings and specific embodiments.

[0042] The embodiment of the present invention provides a method for manufacturing a flexible display substrate and a flexible display substrate mother board, which will not cause damage to the flexible display substrate when the flexible display substrate is separated from the carrier substrate.

[0043] The embodiment of the present invention provides a method for manufacturing a flexible display substrate, such as figure 1 As shown, this embodiment includes:

[0044] Step 11: forming an adhesive layer on the carrier substrate, where the adhesive layer can form irreversible contact with the carrier substrate;

[0045] Step 12: forming a flexible base substrate on the adhesive layer, and the flexible base substrate can form a reversible ...

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Abstract

The invention provides a manufacturing method of a flexible displaying substrate and the flexible displaying substrate and belongs to the technical field of displaying. The manufacturing method of the flexible displaying substrate comprises the steps that a bonding layer is formed on a carrier substrate, and the bonding layer can be in irreversible contact with the carrier substrate; a flexible substratum substrate is arranged on the bonding layer, and the flexible substratum substrate can be in irreversible contact with the bonding layer; a displaying device is arranged on the flexible substratum substrate; and the carrier substrate is heated, the flexible substratum substrate provided with the displaying device is stripped from the carrier substrate with the bonding layer formed, and the flexible displaying substrate is obtained. According to the technical scheme, during separating of the flexible displaying substrate and the carrier substrate, damage to the flexible displaying substrate is avoided.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for manufacturing a flexible display substrate and a flexible display substrate motherboard. Background technique [0002] The flexible display (Flexible Display) technology has developed rapidly in the past ten years, and thus the flexible display has made great progress in terms of screen size and display quality. Flexible displays, also known as rollable displays, are bendable and deformable display devices made of flexible materials and visible flexible panels. Whether it is the CRT (Cathode Ray Tube, cathode ray tube) display that is on the verge of disappearing, or the current mainstream LCD (Liquid Crystal Display, liquid crystal display), they all belong to the traditional rigid display in essence. Compared with ordinary rigid displays, flexible displays have many advantages: impact resistance and stronger shock resistance; light weight, small size, and more co...

Claims

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Application Information

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IPC IPC(8): H01L21/02H01L21/683
CPCH01L21/02H01L21/6835H01L21/683
Inventor 董甜
Owner BOE TECH GRP CO LTD
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