Packaging layer, electronic packaging device and display device

A technology of electronic packaging and packaging layer, which is applied in the electronic field and can solve problems such as unfavorable thinning of electronic devices

Inactive Publication Date: 2015-02-25
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] It can be seen that the existing packaging technology uses the water-oxygen barrier film 303 and the inorganic passivation layer 301 or the packaging film 302 to be bonded by adhesive, which is not conducive to the realization of light and thin electronic devices.

Method used

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  • Packaging layer, electronic packaging device and display device
  • Packaging layer, electronic packaging device and display device
  • Packaging layer, electronic packaging device and display device

Examples

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] Embodiments of the present invention provide an encapsulation layer 30, such as figure 2 As shown, it includes an encapsulation barrier layer 304 and an organic coating 305; wherein, the organic coating 305 is a polymerizable organic coating, and the polymerizable organic coating may include an unsaturated acrylic organic coating.

[0031] It should be noted that, first, the packaging barrier layer 304 can use the inorganic passivation layer 301 shown ...

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PUM

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Abstract

The embodiment of the invention provides a packaging layer, an electronic packaging device and a display device, and relates to the technical field of electronics. The thickness of the packaging layer can be reduced, and therefore the electronic packaging device can be light and thin. The packaging layer comprises a packaging isolation layer and an organic coating. The organic coating can be a polymerizable organic coating. The polymerizable organic coating comprises an unsaturated acrylics organic coating. The electronic packaging device is used for packaging electronic devices.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a packaging layer, an electronic packaging device and a display device. Background technique [0002] Many electronic devices, such as OLED (Organic Light Emitting Diode, organic electroluminescent device) or CCD (Charge-coupled Device, charge-coupled device), are very sensitive to moisture and oxygen in the atmospheric environment; , it needs to be encapsulated to protect it from moisture and oxygen in the atmospheric environment, thereby prolonging its service life. [0003] Taking an OLED display device as an example, as shown in Figure 1(a) and Figure 1(b), in the prior art, an inorganic passivation layer 301 and a water-oxygen barrier film 303, or an encapsulation film 302 and a water-oxygen barrier film 303 In a combined manner, the OLED display device is packaged. Wherein, the water-oxygen barrier film 303 is usually prepared by extruding a polymer material; limited ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/54
CPCH10K59/00H10K50/00H10K50/84H10K50/844H10K50/8445H10K2102/311H10K85/10H10K85/151H10K2102/00H10K2102/351
Inventor 王涛周伟峰张嵩孙韬
Owner BOE TECH GRP CO LTD
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