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High-power optical fiber pumping beam combiner and packaging method thereof

A packaging method and beam combiner technology, which are applied to lasers, laser components, phonon exciters, etc., can solve the problems of complex packaging structure, poor heat dissipation performance, complex packaging process and structure, etc., and achieve good heat dissipation effect and structure. Simple, insignificant effect of calorie hoarding

Active Publication Date: 2015-02-25
INST OF APPLIED ELECTRONICS CHINA ACAD OF ENG PHYSICS
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AI Technical Summary

Problems solved by technology

[0003] At present, the packaging structure of fiber pump combiners is generally complex, and the heat dissipation performance is poor, especially the package heat dissipation of kW-level high-power fiber pump combiners generally adopts water cooling, and its packaging process and structure are relatively complex

Method used

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  • High-power optical fiber pumping beam combiner and packaging method thereof
  • High-power optical fiber pumping beam combiner and packaging method thereof

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Embodiment Construction

[0027] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0028] Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless expressly stated otherwise, may be replaced by alternative features which are equivalent or serve a similar purpose. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0029] Such as figure 1 , the present invention includes upper cover, base plate, input pumping optical fiber bundle and output pumping optical fiber welded together; input pumping optical fiber bundle and output pumping optical fiber are horizontally placed on the base plate; both ends and the middle of the base plate are provided with grooves ; The input pumping fiber bundle is placed on the groove at one end of the substrate; the output pu...

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Abstract

The invention provides a technical scheme about a high-power optical fiber pumping beam combiner and a packaging method of the high-power optical fiber pumping beam combiner. According to the method, the input end and the output end of an optical fiber waveguide structure are skillfully coated with two lines of UV adhesive high in refractive index, wherein the optical fiber waveguide structure is obtained after tapering shaping is carried out and comprises N input pumping optical fibers, a taper area, a welding point and an output optical fiber, so that the optical fiber waveguide structure is fixed to an aluminum substrate with grooves, and an aluminum upper cover the same as the grooves of the aluminum substrate in structure is used for adhesive dispensing sealing to complete packaging of the pumping beam combiner. The packaged pumping beam combiner is simple in structure, the heat accumulation phenomenon is not obvious, the heat dissipating effect is good, the device is not prone to damage, and the tolerance power can reach the magnitude from kW to multiple kW.

Description

technical field [0001] The invention relates to an optical device and a packaging method thereof, in particular to a high-power optical fiber pump beam combiner and a packaging method thereof. Background technique [0002] In the prior art, it is known that the fiber pump beam combiner has the advantages of convenient use, high coupling efficiency, and high integration, and has become the main pump coupling method in fiber lasers. The main composition of the fiber pump beam combiner consists of two parts: one is the fiber waveguide structure after being tapered and shaped; the other is the packaging structure. The packaging of the fiber pump combiner should have the following three functions: one is to effectively fix the fiber waveguide structure in the pump combiner; the other is to effectively absorb the stray light in the pump combiner; the third is to The waste heat in the pump combiner is effectively transferred, thereby reducing the thermal effect of the pump combine...

Claims

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Application Information

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IPC IPC(8): H01S3/091H01S3/042
Inventor 范国滨吴娟张凯孙殷宏马毅唐淳张卫王岩山冯昱骏李腾龙高清松
Owner INST OF APPLIED ELECTRONICS CHINA ACAD OF ENG PHYSICS
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