Transparent conductive film having bending resistance, and method for manufacturing same
A technology of transparent conductive film and transparent conductive layer, which is applied in the direction of conductive layer, circuit, electrical components, etc. The effect of bending resistance
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[0050] Preparation method of transparent conductive film
[0051] An example of the present invention provides a preparation method of a transparent conductive film, the preparation method of the transparent conductive film includes the following steps: a step of forming a hard coat layer on both sides of the transparent substrate; and on the above hard coat layer, by The step of forming a transparent conductive layer by sputtering method.
[0052] In the step of forming a hard coat layer on both sides of the above-mentioned transparent substrate, the formation method of the hard coat layer can be realized by a common coating method, for example, bar coating (bar coating), blade coating (blade coating). , spin coating, gravure coating and spray coating, etc.
[0053] In the step of forming the transparent conductive layer on the hard coat layer, the method for forming the transparent conductive layer is not particularly limited, and conventionally known methods can be selecte...
Embodiment 1
[0059] As a hard coat forming material, 5 parts by weight of a photopolymerization initiator is added to 100 parts by weight of an acrylic polyurethane resin (UNIDIC 17-806 manufactured by Nippon Ink Chemicals Co., Ltd.). Hydroxycyclohexyl phenyl ketone (IRGACURE 184 manufactured by Chiba Specialty Chemicals Co., Ltd.), a toluene solution diluted at a concentration of 30% by weight was prepared.
[0060] This hard coat layer forming material was applied to both sides of a transparent substrate formed of a polyethylene terephthalate (PET) film having a thickness of 125 μm, and dried at 100° C. for 3 minutes. After that, immediately use an ozone-type high-pressure mercury lamp (energy density of 80W / cm 2 , 15cm spotlight type) 2 lamps to implement ultraviolet radiation to form a hard coating.
[0061] Then, in an atmosphere of 0.4 Pa formed by 98% argon and 2% oxygen, the above-mentioned hard coating was applied by a reactive sputtering method using a sintered body material of ...
Embodiment 2 to Embodiment 4
[0063] In Examples 2 to 4, except that the thicknesses of the above-mentioned hard coat layers formed on the upper and lower portions of the polyethylene terephthalate (PET) film were 2.5 μm, 3.1 μm, 5.3 μm, and 7.2 μm, respectively Except that, a transparent conductive film was prepared by the same method as in Example 1.
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