A method for manufacturing fine lines of printed circuit boards
A technology for printed circuit boards and fine circuits, which is used in printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problem that the energy of laser ablation on the surface of the substrate is not easy to control, it is difficult to achieve large-scale industrial production, and it is difficult to obtain fine Line grooves and other problems, to achieve the effect of regular shape, line width matching, and low cost
Inactive Publication Date: 2017-11-17
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology
This method is to ablate the circuit groove on the substrate, and then make the circuit in the groove. This method can effectively avoid the problem of side erosion of the circuit, but due to the difference in the material of the substrate surface and the energy of laser ablation is not easy to control, It is difficult to obtain complete and regular fine circuit grooves, and laser ablation is time-consuming, costly, and inefficient, and it is difficult to achieve mass industrial production
Method used
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[0031] A method for manufacturing fine lines of a printed circuit board, comprising the following steps:
[0032] Step 1: paste the first dry film 111 on the surface of the copper-free substrate 110, and then perform exposure and development to obtain fine circuit grooves 113, such as figure 1 shown;
[0033] Step 2: Copper plating is performed on the surface of the base material treated in step 1, so that the upper surface of the first dry film 111 and the inner surface of the fine line groove 113 form a copper seed layer 210, such as figure 2 shown;
[0034] Step 3: Paste the second dry film 112 on the surface of the copper seed layer obtained after the treatment in step 2, and then perform exposure and development treatments to expose the fine line groove 113, such as image 3 shown;
[0035] Step 4: Carry out electroplating and copper filling treatment on the base material treated in step 3, and fill the fine line groove 113, such as Figure 4 shown;
[0036] Step 5:...
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The invention provides a method for manufacturing fine lines of a printed circuit board, which belongs to the field of printed circuit board manufacturing. The present invention forms fine circuit grooves by pasting a dry film, exposing and developing, and then depositing a copper seed layer, pasting a dry film, electroplating and filling copper, removing the film, and rapid etching to obtain a fine circuit. The method of the present invention can not only greatly Reducing the line width and line spacing of the circuit can also effectively avoid the side erosion problem when removing the copper seed layer. The method of the invention is easy to operate, low in cost, and avoids the use of expensive and complicated equipment; and the shape of the groove of the fine line formed by the method is regular, which overcomes the problem of irregular shape of the groove formed by laser ablation, and the shape of the obtained line is complete, which is similar to The designed line width matches to meet the impedance requirement.
Description
technical field [0001] The invention belongs to the field of printed circuit board manufacture, and in particular relates to a method for manufacturing fine lines of a printed circuit board. Background technique [0002] With the miniaturization of electronic equipment, the volume of electronic components is getting smaller and higher, and the arrangement density is getting higher and higher, which requires the circuit board as the carrier of electronic components to have smaller line width and line spacing; at the same time, the transmission of high-frequency signals and The requirements for the integrity of the transmission signal put forward higher requirements for the line impedance design of the circuit board, and the corresponding line pattern should have smaller side erosion, fewer defects, and better integrity. [0003] At present, there are mainly three methods for making fine circuits on circuit boards: subtractive method, semi-additive method, and full-additive me...
Claims
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IPC IPC(8): H05K3/20H05K3/10
CPCH05K3/107H05K2203/0502H05K2203/0789
Inventor 何为李松松何雪梅王守绪周国云陈苑明冀林仙
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA