Manufacturing method of blind holes with different apertures and printed circuit board
A technology for printed circuit boards and manufacturing methods, which is applied in the directions of printed circuits, printed circuit manufacturing, and printed circuit components, and can solve problems that affect production costs, production efficiency and product quality, poor laser drilling alignment, and long production processes. and other issues, to achieve the effect of shortening the manufacturing process, precise location and low production cost
Active Publication Date: 2017-10-03
NEW FOUNDER HLDG DEV LLC +1
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Problems solved by technology
[0003] However, the laser drilling process used in the prior art adopts the method of first opening a window on the copper surface and then performing laser drilling. The production process is long, the cost is high, and the laser drilling alignment is poor; it affects production costs, production efficiency and product quality. quality
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[0021] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.
[0022] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways than described here. Therefore, the protection scope of the present invention is not limited by the specific implementation disclosed below. Example limitations.
[0023] Such as figure 1 As shown, the present invention provides a method for manufacturing blind holes with different apertures, which is used to make blind holes 11 with different apertures on the same lay...
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The invention provides a manufacturing method of blind holes different in pore diameter, and a printed circuit board. The manufacturing method of the blind holes different in pore diameter are used for manufacturing the blind holes different in pore diameter on the same layer of the printed circuit board and comprises the following steps: step 102, grouping the blind holes which are different in pore diameter and to be formed, preparing a laser drilling program according to the grouping, and inputting the laser drilling program to a laser drilling machine; step 104, browning and roughing the surface of a laminated base plate; step 106, forming the blind holes in the surface-browned and roughed base plate by using the laser drilling machine. The technical scheme provided by the invention has the advantages that the manufacturing procedures of the blind holes different in pore diameter are shortened, the manufacturing cost of the blind holes different in pore diameter is reduced and the quality of the blind holes different in pore diameter on the same layer of the printed circuit board is guaranteed, so that the quality of the printed circuit board is guaranteed and the completeness of an electronic product and the cooling performance of elements can be effectively guaranteed.
Description
technical field [0001] The invention relates to the field of printed circuit board manufacturing, and more specifically, to a method for manufacturing blind holes with different apertures and a printed circuit board. Background technique [0002] With the continuous upgrading of electronic products, electronic products have higher and higher requirements for heat dissipation of signals and components. The printed circuit board as the carrier of electronic product components, in order to ensure the integrity of the product signal and the heat dissipation of the components, in design, the blind holes located on the same layer of the printed circuit board need to have a variety of apertures to meet its performance requirements . For blind hole drilling with different apertures, the traditional laser drilling operation method is to open copper windows of different sizes at the blind hole position according to the design requirements after the outer layer is laminated, and then ...
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IPC IPC(8): H05K3/40H05K1/11
CPCH05K3/0047H05K3/4038H05K2203/107
Inventor 金立奎
Owner NEW FOUNDER HLDG DEV LLC