Substrate treatment device and device manufacturing method

A substrate processing device and substrate technology, which are applied to originals for photomechanical processing, exposure devices for photolithography, and instruments, can solve the problems of difficult to suppress the total cost and high cost of display panels, and achieve high precision Effects of projection exposure and high-efficiency exposure

Active Publication Date: 2015-03-18
NIKON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These exposure equipment, processing equipment, and transport equipment are extremely large and expensive, and it is difficult to suppress the total cost related to the production of the display p

Method used

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  • Substrate treatment device and device manufacturing method
  • Substrate treatment device and device manufacturing method
  • Substrate treatment device and device manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0063] figure 1 It is a figure which shows the structure of an example of the device manufacturing system SYS (flexible display manufacturing line) of this embodiment. Here it is shown that the flexible substrate P (sheet, film, etc.) pulled out from the supply reel FR1 passes through n processing devices U1, U2, U3, U4, U5, ... Un in sequence until it is wound up in the recovery process. Example on reel FR2.

[0064] In the following description, regarding the XYZ rectangular coordinate system, the front surface (or back surface) of the substrate P is set to be perpendicular to the XZ plane and the width direction perpendicular to the conveyance direction (longitudinal direction) of the substrate P is set to be is the direction of the Y axis. In the following description, the rotation direction around the X-axis direction is referred to as the θX-axis direction, and similarly, the rotation directions around the Y-axis direction and the Z-axis direction are respectively refe...

no. 2 Embodiment approach

[0156] Next, a second embodiment will be described. In this embodiment, the same reference numerals are attached to the same components as those in the above-mentioned embodiment, and descriptions thereof are simplified or omitted.

[0157] Figure 14 It is a figure which shows the structure of the processing apparatus (exposure apparatus EX2) of this embodiment. Figure 14 Exposure apparatus EX2 shown differs from 1st Embodiment in the point that projection optical system PL is comprised by the optical system like an Offner optical system.

[0158] The projection optical system PL includes: a first projection optical system PL1 forming an intermediate image Im of a part (illumination region IR) of the mask pattern M; and a second projection optical system PL2 forming an intermediate image Im formed by the first projection optical system PL1 The projection area PR projected on the substrate P. Here, 1st projection optical system PL1 and 2nd projection optical system PL2 are...

no. 3 Embodiment approach

[0169] Next, a third embodiment will be described. In this embodiment, the same reference numerals are attached to the same components as those in the above-mentioned embodiment, and descriptions thereof are simplified or omitted.

[0170] Figure 16 It is a figure which shows the structure of the device manufacturing system SYS2 (flexible display manufacturing line) of this embodiment. Here, it is shown that the flexible substrate P (sheet, film, etc.) pulled out from the supply reel FR1 passes through n processing devices U1, U2, U3, U4, U5, ... Un in sequence until it is wound on Example on recycling reel FR2.

[0171] exist Figure 16 In , the XYZ orthogonal coordinate system is also set so that the surface (or back surface) of the substrate P is perpendicular to the XZ plane, and the direction (width direction) orthogonal to the conveyance direction (length direction) of the substrate P is set is the direction of the Y axis.

[0172] Next, the exposure principle of t...

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Abstract

This substrate treatment device (EX) is equipped with: a projection light system (PL) that forms an image of a mask pattern on a substrate by projecting a reflected light beam (L2), which is generated from an illumination region (IR), toward the substrate; a light separation section (10) that allows either illumination light emitted toward the illumination region or an imaging light beam generated from the illumination region to pass and reflects the other; and an illumination light system (IL) that forms a primary light source image, emits illumination light from the primary light source image to the illumination region, and forms a first conjugate plane, which is optically conjugate to the illumination region, between a central line and a cylindrical surface.

Description

technical field [0001] The invention relates to a substrate processing device and a device manufacturing method. [0002] This application claims priority based on Japanese Patent Application No. 2012-157810 filed on July 13, 2012 and Japanese Patent Application No. 2012-157811 filed on July 13, 2012, and the contents thereof are incorporated herein. Background technique [0003] As a substrate processing apparatus for patterning electronic circuits such as semiconductor integrated devices and display panels, precise exposure apparatuses are widely used. This exposure device is generally a device that optically transfers a pattern of an electronic circuit formed on a mask (mask) onto a photosensitive substrate such as a semiconductor wafer or a glass substrate via a projection optical system. The photomask used therein is usually formed by forming a circuit pattern on a flat quartz plate through a light-shielding material such as chromium. The bottom moves in a step-and-sc...

Claims

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Application Information

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IPC IPC(8): G03F7/24G02B13/24G02B17/08G03F1/50G03F7/20
CPCG03F7/24G03F7/70058G03F7/70091G03F7/7015G03F7/70316G02B13/24G02B17/08G03F1/50G03F7/20G03F7/70833
Inventor 熊泽雅人
Owner NIKON CORP
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