Method for manufacturing ultra-thin type touch switch

A technology of tact switch and manufacturing method, applied in electrical switches, electrical components, circuits, etc., can solve the problems of high manufacturing cost, increase of plastic nozzle material, obvious mold clamping pattern, etc., and achieve manufacturing cost and quality improvement. The effect of shortening cycle time and shortening process time

Active Publication Date: 2015-03-25
SHENZHEN DONGQIANG PRECISE PLASTIC & ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. The manufacturing cost is high, the purchase of plastic raw materials for baking, injection molding, and cleaning, the operation cycle is long, takes up a large space, requires more equipment, and invests a lot of money
For example: a. It needs to occupy a large storage space to place injection molding equipment; b. It needs to be equipped with professional equipment operation and maintenance technicians; c. It needs to increase the proportioning equipment of plastic raw materials (for matching toner and color masterbatch); d. Add crushing equipment to deal with the residual plastic nozzle material after injection molding; e. The storage of plastic nozzle materials requires storage space; f. The back end needs to increase cleaning equipment to avoid the intrusion of dust, and materials, equipment, and personnel maintenance all take up a lot of time resource
[0004] 2. Long production cycle, many production processes and control steps
[0005] 3. The size of the switch is large. The traditional injection molding process is limited to injection molding equipment, mold precision, and product yield. The product size of the tact switch has always been large. The products are becoming more and more precise, smaller and smaller, and occupy less space. However, in terms of quality control, due to more production steps, the production yield of light touch switches with small volume and ultra-thin products is still not optimistic.
[0006] 4. The dustproof and waterproof effects are unstable, and the plastic raw materials need to be melted again. Injection molding switch base, due to uncertain factors such as injection molding parameters and equipment stability, it is easy to cause obvious mold lines on the base or weak adhesion to metal terminals. , resulting in product cracks or gaps, dust and water vapor are relatively easy to infiltrate, resulting in functional loss of switch products, directly affecting the use of end products

Method used

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  • Method for manufacturing ultra-thin type touch switch
  • Method for manufacturing ultra-thin type touch switch
  • Method for manufacturing ultra-thin type touch switch

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] a. Firstly, the supplier is required to cut the PI film with a base film 1 of 2MIL into a fixed size, and make it into a coil or a sheet with a fixed shape, which is convenient for subsequent stamping and forming mold processing. It is also possible to ask the supplier to directly provide processed coils or sheets with fixed specifications. The side of the PI film that contacts the card must be coated with semi-cured high-temperature epoxy resin, and the surface is protected by a plastic film. Before removing the plastic film, it cannot If there is dust or impurities infiltrated, the PI film is stamped and made into a roll or sheet of the size and specification of the bottom film required by the switch for use.

[0050] b. Secondly, the supplier is required to cut the 1 / 2MIL PI film of the mask 3 into a fixed size, and make it into a coil or a sheet of a fixed shape, which is convenient for subsequent stamping and forming mold processing. Suppliers can also be require...

Embodiment 2

[0065] A method of manufacturing an ultra-thin tact switch, using hot pressing from bottom to top in order to heat press the base film, A / B PIN pin, mask, cavity, metal shrapnel, button and top film; wherein: the manufacturing method Proceed as follows:

[0066] 1) Material preparation:

[0067] ① Cut the PI film with a base film of 2 MIL, the PI film with a surface mold of 1 / 2 MIL, and the PI film with a cavity of 7 MIL to a fixed size, make it into a coil or sheet, and stamp it into a mold for use;

[0068]② Cut the PI film with a top film of 2MIL into a fixed size, coat it with high-temperature epoxy resin, integrate the silicone button into the high-temperature epoxy resin to form a whole with the PI top film, and make it into a coil or a fixed-shaped plate for subsequent Stamping mold processing and production;

[0069] ③Punch the metal material into the sheet or wire of the A / B Pin structure required by the switch for use;

[0070] ④Silver-coated or silver-pressed or ...

Embodiment example 3

[0088] A method of manufacturing an ultra-thin tact switch, using hot pressing from bottom to top in order to heat press the base film, A / B PIN pin, mask, cavity, metal shrapnel, button and top film; wherein: the manufacturing method Proceed as follows:

[0089] 1) Material preparation:

[0090] ①Cut the PI film with a base film of 2MIL, the PI film with a surface mold of 1 / 2MIL, and the PI film with a cavity of 7MIL into a fixed size, make it into a coil or sheet, and stamp the mold for use;

[0091] ② Cut the PI film with a top film of 2MIL into a fixed size, coat it with high-temperature epoxy resin, integrate the silicone button into the high-temperature epoxy resin to form a whole with the PI top film, and make it into a coil or a fixed-shaped plate for subsequent Stamping mold processing and production;

[0092] ③Punch the metal material into the sheet or wire of the A / B Pin structure required by the switch for use;

[0093] ④Silver-coated or silver-pressed or silver-...

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Abstract

The invention discloses a method for manufacturing an ultra-thin type touch switch. The product manufacturing procedures include that PI film (or a thin plate), a silica gel button, a PI top film raw material and a hardware raw material are fed for raw material inspection; then bottom film, face film, a cavity, an A/B PIN are molded in a punching mode; the e-plating subcontractor is carried out on the A/B PIN; primary hot-press bonding of the bottom film, the A/B PIN and the face film, secondary hot-press bonding of the bottom film, the A/B PIN and the face film, metal elastic sheet implantation, top film covering, third-time hot-press bonding, cutting molding, product detection and braiding packaging are carried out. The method has the advantages that the process is simple, the device occupation space is small, the production steps are few, and the quality is easily managed and controlled.

Description

technical field [0001] The invention relates to the technical field of electrical switches, in particular to a method for manufacturing an ultra-thin tact switch. Background technique [0002] The existing tact switch technology is injection molding, the main raw material is plastic raw material (PA66 / PA66 plus glass fiber / PA4T / PA6T / PA9T / LCP, etc.) High-temperature extrusion injection into the forming mold, cooling and forming, the product forming cycle is long, there are many production links, the control is cumbersome, and the quality abnormalities emerge in endlessly. Has the following prominent disadvantages: [0003] 1. The manufacturing cost is high. Purchase plastic raw materials for baking, injection molding, and cleaning. The operation cycle is long, takes up a lot of space, requires a lot of equipment, and invests a lot of money. For example: a. It needs to occupy a large storage space to place injection molding equipment; b. It needs to be equipped with professi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H11/00
CPCH01H11/005
Inventor 赵军对
Owner SHENZHEN DONGQIANG PRECISE PLASTIC & ELECTRIC
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