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Heat-diffusing sound insulation sheet and heat-diffusing sound insulation structure

A thermal diffusivity, sound insulation board technology, used in cooling/ventilation/heating renovation, sound-generating equipment, instruments, etc., can solve problems such as large vibration and sound, and achieve the effect of suppressing noise

Inactive Publication Date: 2015-03-25
SEKISUI POLYMATECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially when multiple ceramic capacitors are mounted on the board, louder vibration noise is likely to occur

Method used

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  • Heat-diffusing sound insulation sheet and heat-diffusing sound insulation structure
  • Heat-diffusing sound insulation sheet and heat-diffusing sound insulation structure
  • Heat-diffusing sound insulation sheet and heat-diffusing sound insulation structure

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0043] The first embodiment ( figure 2 ):

[0044] The heat diffusing sound insulating panel 10 of this embodiment includes figure 2 The sound insulating member 15 and the thermal diffusion member 16 shown are formed in the shape of laminated thin plates. Then, the heat diffusing sound insulating sheet 10 is installed in the notebook computer 1 such that the heat diffusing member 16 faces the case 2 side and the sound insulating member 15 faces the substrate 4 side.

[0045] (soundproof member)

[0046] The soundproof member 15 is made of a porous body such as a foam for blocking sound or a polymer composition filled with a hollow filler. The sound insulating member 15 has a thin plate shape and has flexibility so as to be easily attached to a narrow space such as a gap between the electronic component 5 and the case 2 .

[0047] The material of the foam is resin or rubber such as polystyrene, polyurethane, polyethylene, silicone, acrylonitrile copolymer, polyolefin ru...

no. 2 approach

[0061] The second embodiment ( image 3 (A)):

[0062] image 3 (A) is a cross-sectional view showing the heat diffusing sound insulating panel 20 of this embodiment. The heat-diffusing sound-insulating panel 20 has a high-density layer 15a made of a foam compressed in the sound-insulating member 15, and is laminated with a standard-density layer 15b made of only a foam.

[0063] For the porous structure of the standard density layer 15b made of foam only, spherical or ellipsoidal voids are formed, but for the porous structure of the high-density layer 15a composed of compressed foam, the voids An indeterminate shape that has been deformed by pressure.

[0064] The high-density layer 15a is obtained by heating and compressing an uncompressed foam. For example, in order to make the apparent density reach 70~350kg / m 3 To some extent, the compressed foam can be used as the high-density layer 15a.

[0065] In the course of completing the present invention, experiments were...

no. 3 approach

[0090] The third embodiment ( Figure 4 (A)):

[0091] Figure 4 (A) shows the cross-sectional view of the thermal diffusivity sound insulation panel 30 of this embodiment. The heat diffusing sound insulating board 30 has a concave portion 18 protruding from the substrate 4 for accommodating the electronic component 5 . Moreover, the recessed part 18 has the window part 18a located in the position which makes the electronic component 5 and the thermal diffusion member 16 face each other.

[0092] To manufacture the heat diffusing sound insulating board 30 , the portion of the sound insulating member 15 corresponding to the electronic component 5 is punched, and the recessed portion 18 with the window portion 18 a can be formed by laminating the heat diffusing member 16 on this portion.

[0093] Since the heat diffusing sound insulating sheet 30 surrounds the electronic component 5 with the side surface 17 , it is possible to reliably prevent sound leakage in the extending...

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Abstract

The purpose of the present invention is to provide a heat-diffusing sound insulation sheet provided with excellent sound insulating properties and heat diffusing properties and a heat-diffusing sound insulation structure using the heat-diffusing sound insulation sheet. The heat-diffusing sound insulation sheet is obtained by laminating a heat-diffusing member (16) on a sound-insulating member (15). By disposing same inside an external member such as a casing (2), keyboard (3), etc. of a small electronic device, noise generated from an electronic part (5) or a circuit board (4) on which an electronic part (5) is mounted can be insulated. Moreover, by diffusing the heat generated from the electronic part (5) or the circuit board (4) on which the electronic part (5) is mounted, discomfort due to hot spots generated on the external member can be reduced.

Description

technical field [0001] The present invention relates to technology for suppressing noise from electronic components in electronic equipment or substrates on which electronic components are mounted, and for dissipating heat. Background technique [0002] Various electronic devices such as personal computers and mobile phones are equipped with many electronic components such as hard disk drives, cooling fans, and motors. Noise generated by these electronic components has always been a problem. [0003] Especially in recent years, small electronic devices such as thin and lightweight notebook computers and smartphones have realized miniaturization of substrates, and electronic components such as capacitors, inductors, and varistors are mounted at high density on these miniaturized substrates. [0004] Among electronic components, multilayer ceramic capacitors vibrate by inducing electrical distortion of the ceramic material of the body when an alternating current is applied. I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G10K11/16B32B5/18H01L23/36H05K7/20
CPCB32B5/18B32B2307/102B32B2307/302B32B2307/304G06F1/18G06F1/182G06F1/203H01L23/36H01L2924/0002H01L2924/00
Inventor 仁木草洋子福冈达也
Owner SEKISUI POLYMATECH CO LTD
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