Binding method of display screen body
A display and bonding technology, applied in the manufacturing of semiconductor devices, electric solid-state devices, semiconductor/solid-state devices, etc., can solve problems such as the inability of the screen to bond, prevent water and oxygen from entering the interior of OLED devices, improve density, The effect of low production cost
Active Publication Date: 2015-04-01
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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Problems solved by technology
[0010] For this reason, what the present invention intends to solve is the problem that the screen body cannot be bonded in the packaging method based on the atomic layer deposition process in the prior art, and a bonding method for the display body is provided
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[0035] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0036] This embodiment provides a bonding method for a display screen body. The display screen body includes a substrate on which a display area and a bonding area are arranged. The bonding method includes the following steps:
[0037] S1, such as Figure 5 As shown, the first electrode layer (ITO anode pattern) is formed on the substrate 1, and the first electrode pattern arranged in the display area and the bonding pattern arranged in the bonding region 3 are etched out through a mask.
[0038] S2. Deposit photoresist on the display area, so that the display area is protected by photoresist, and the bonding area 3 (IC bonding area) is exposed as a whole;
[0039] Use F plasma in chemical vapor deposition CVD or dry etching Dry Etch ...
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Abstract
The invention provides a binding method of a display screen body. The display screen body comprises a substrate, wherein a display area and a binding area are arranged on the substrate. The binding method comprises the following steps: S1, forming a first electrode layer on the substrate, etching a first electrode figure arranged in the display area and a binding figure arranged in the binding area, S2, depositing photoresist on the display area, treating the surface of the binding area with F-plasma to allow F ions to cover the binding area, and S3, removing the photoresist from the display area, and forming a functional layer and a package layer covering the display area on the substrate in sequence by an atom layer deposition technology. Since the surface of the binding area treated by the F-plasma is lack of a hydroxyl group, the package layer can hardly grow in the binding area, and the exposed binding area can be obtained to achieve binding of the screen body.
Description
technical field [0001] The invention relates to the field of flat panel display technology, in particular to a bonding method for a display body. Background technique [0002] Organic electroluminescent display device (English full name is Organic Light-Emitting Display, referred to as OLED) is a new display technology, because of its advantages of high luminous brightness, rich colors, low-voltage DC drive, simple preparation process, etc., it is increasingly becoming an international display technology. research hotspot. Compared with the existing mainstream display device - active-driven liquid crystal display device, the short life is still one of the important factors restricting the commercialization of OLED. [0003] Studies have shown that components such as water vapor and oxygen in the air have a great impact on the life of OLEDs. The main reason is that OLEDs mainly inject electrons from the cathode, which requires the cathode material to have an extremely low wo...
Claims
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Login to View More IPC IPC(8): H01L27/32H01L51/52H01L51/56
Inventor 刘雪洲刘胜芳林立柳冬冬平山秀雄
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD